Toshiba Celebrates Completion of New Back-End Production Facility for Power Semiconductors
March 5, 2025
Toshiba Electronic Devices & Storage Corporation
Kawasaki, Japan–Toshiba Electronic Devices & Storage Corporation ("Toshiba") today held a ceremony to mark the completion of a new back-end production facility for automotive power semiconductors at Himeji Operations – Semiconductor, in Hyogo Prefecture, western Japan. The new facility will more than double capacity against the fiscal 2022 level, and will commence full-scale production in the first half of fiscal year 2025.
The new facility is designed to promote smart factory initiatives through automation of the manufacturing process and the use of RFID[1] tags to improve work the efficiency and accuracy of inventory management accuracy. All power requirements will be met with electricity from renewable sources, including solar panels installed on the roof of the building under a power purchase agreement.
Power devices play a crucial role in supplying and controlling electricity, and are essential for improving energy efficiency in all kinds of electrical and electronic equipment. The continuing electrification of automobiles and higher efficiency requirements for industrial equipment are expected to drive long-term demand for power semiconductors. Toshiba is responding with investments in both front-end and back-end production facilities, and will meet market growth with a stable supply of high-efficiency and high-reliability products.
The new facility more than doubles Himeji Operations’ production capacity for automotive power semiconductor against fiscal year 2022, and will reinforce its contributions to advancing carbon neutrality.
Overview of the New Facility
Building Area: 4,760.31 m2
Total Floor Area: 9,388.65 m2
Structure: Steel frame, 2 floors above ground
Completion: March, 2025
Purpose: Manufacturing of power semiconductors (back-end process)
Overview of Himeji Operations – Semiconductor
Location: 300, Ikaruga, Taishi-cho, Ibo-gun, Hyogo Prefecture, Japan
Site Area: 246,800.08 m2
Established: April, 1982
General Manager: Kyozo Takeo
Employees: Approx. 1,400 (as of January, 2025)
Main Products: Discrete semiconductors (power semiconductors and small-signal devices)
[1] Radio Frequency Identification (RFID) refers to automatic recognition technology that utilizes small IC chips to record information and antennas.
* Company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.