11th March 2026
Toshiba Electronics Europe GmbH (“Toshiba”) announces the launch of four new voltage-driven photorelays - TLP3407SRB, TLP3412SRB, TLP3412SRHB, and TLP3412SRLB - engineered to address the evolving needs of design engineers working on next-generation test and measurement equipment. These new photorelays are rated for operation at temperatures up to 135°C and are housed in ultra-compact S-VSON4T package, measuring just 1.45 × 2.0 mm (typ.).
As the automotive industry moves toward electrification and autonomous driving, engineers are increasingly challenged to design circuits that can withstand elevated temperatures and fit more functionality into ever-smaller spaces. The new Toshiba photorelays directly address these demands by offering a higher maximum operating temperature than existing 125°C-rated products, ensuring reliable performance even in the most thermally demanding environments, such as automotive semiconductor testers, burn-in systems, and probe cards.
For design engineers, the integration of built-in input resistors means these photorelays can be driven directly by voltage, eliminating the need for external resistors and simplifying circuit design. This not only reduces component count but also frees up valuable board space, enabling more compact, efficient layouts. The S-VSON4T package further supports high-density mounting, enabling engineers to integrate multiple relays into limited board space without compromising on performance or reliability.
The TLP3407SRB, in particular, offers an ON-state current rating of up to 1A, while the TLP3412SRB, TLP3412SRHB, and TLP3412SRLB provide robust switching capabilities with low ON-state resistance and fast response times. These characteristics make the new series especially well-suited for applications where high-speed, high-reliability switching is critical.
With the introduction of these new photorelays, Toshiba continues to support design engineers in overcoming the challenges of modern electronic system development, providing solutions that enhance reliability, simplify design, and maximise board space efficiency.