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This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.
Package Code
Package Image
Land pattern
Package name
(Toshiba)
Width (mm)
Length (mm)
Total Thickness
(mm)
Body Size
(mm^2)
Pin Pitch
(mm)
Number of pins
Mount
Product Category
Package Code Package Image |
Land pattern | Package name (Toshiba) |
Width (mm) | Length (mm) | Total Thickness (mm) |
Body Size (mm^2) |
Pin Pitch (mm) |
Number of pins | Mount | Product Category | |
---|---|---|---|---|---|---|---|---|---|---|---|
Total:186
Hit Count:186
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