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Toshiba launch high current photorelays in DIP4 package

30th July 2018

Advanced performance and extended temperature enables easier use

Toshiba launch high current photorelays in DIP4 package
Toshiba launch high current photorelays in DIP4 package

Toshiba Electronics Europe (“Toshiba”) has launched two new high current photorelays that are fabricated using the latest U-MOS IX semiconductor process.

The new TLP3553A and TLP3555A devices feature OFF-state output terminal voltage ratings of 30 V and 60 V, and ON-state continuous current ratings of 4 A and 3 A – higher than previous generation products. When operated in pulsed mode, the current ratings increase to 9 A for both devices.

Common applications for these devices include industrial equipment (PLCs, I/O interface, sensor controls), building automation systems (heating, ventilation and air conditioning [HVAC]), security equipment and the replacement of mechanical relays in legacy systems.

The TLP3553A features a low ON-state resistance of just 50mΩ (max.) which is less than a typical mechanical relay (about 100mΩ). This ensures that operating losses are kept to a minimum when the device is used to replace mechanical relays such as 1-Form-A that are commonly used in industrial applications. The photorelays are rated for operation at temperatures between -40°C and +110°C, making it easy to achieve a thermal margin in designs.

When mechanical relays are replaced with photorelays, such as the TLP355xA devices, then system reliability is immediately improved. As the photorelays are physically smaller than a mechanical relay, and no additional driver is required, then space and weight is also saved. Both TLP3553A and TLP3555A are provided in a DIP4 package both with and without surface mount option.

Both devices are now shipping in production quantities.

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