13th March 2018
New devices boast the industry’s smallest footprint
Toshiba Electronics Europe today announced the launch of two high speed signal transmission photorelays that offer the industry’s smallest footprint.
The TLP3475S features low on-state output resistance (RON) – typically 1.1Ω and offers fast switching times of 0.5ms (ton) and 0.4ms (toff). The device is rated for 60V (VOFF) and a max. current of 0.4A (ION). The device is housed in an S-VSON4 package measuring just 2.00mm x 1.45mm x 1.65mm.
The TLP3440S is housed in a new S-VSON4T package, which has the same industry-leading small footprint (2.00mm x 1.45mm) as the S-VSON4 but is thinner at just 1.30mm. The TLP3440S features a low RON of 12.0Ω (typ.) and is rated for 40V (VOFF) and a max current of 0.12A (ION). Its switching times are 0.2ms (ton) and 0.3ms (toff).
When off, both devices consume just 1nA (IOFF). The footprint of the new photorelays is 22.5% smaller than that of existing VSON4 packages. Used in combination, the new devices will help to reduce PCB sizes in all applications including semiconductor testers, probe cards and replacement of mechanical relays. They can be also be used in gigahertz high-speed signal transmission lines.
Unlike typical photorelays, which have a maximum operating temperature of 85°C, the TLP3440S and TLP3475S can operate between -40°C and 110°C, and therefore simplify system design – especially in industrial and other rugged applications.
The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with a 23% sale-based market share in CY2016. (Source: Gartner, Inc. “Market Share: Semiconductor Devices and Applications Worldwide 2016” 30 March, 2017)
Toshiba Devices and Storage Corporation (TDSC) will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.
 As of 22 September 2017, TDSC survey