4th April 2018
Housed in a small SO6 package, new device offers 3.75 kVrms isolation
Toshiba Electronics Europe has released a new photorelay in a small 4-pin SO6 package, for factory automation and other industrial applications including semiconductor test, security systems and building automation.
The new TLP176AM incorporates MOSFETs fabricated with the latest U-MOS IX process. It has a rated on-state output terminal voltage (VON) of 60V and a constant on-state current (ION) of 0.7A with pulse operation up to 2.1 A. At 3.75 kVrms, the new device provides higher ESD immunity than the current TLP172AM. The new photorelay is upwards compatible with the earlier TLP172A, in terms of both performance and footprint.
As the TLP176AM is normally-open, it is suitable for use as a replacement for 1-Form-A mechanical relays. By replacing mechanical relays with photorelays system reliability is improved and the space required for relays and relay drivers is reduced. As TLP176AM has a rated operating temperature between -40°C and 110°C it is suitable for industrial applications and easier to allow a temperature margin in system-level thermal design.
The device offers fast switching times of 3 ms (tON) and 0.5 ms (tOFF) with an isolation voltage of 3750 Vrms. It is housed in a small 4-pin SO6 package and fully approved to UL1577 for safety-critical applications.
Volume shipments begin today.
Toshiba Electronic Devices & Storage Corporation will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.
Follow the link below for more information on the new product and photorelays line-up: