Toshiba to Expand Power Semiconductor Production Capacity with New Production Facility
December 19, 2022
Toshiba Electronic Devices & Storage Corporation
KAWASAKI, Japan – Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced that it will construct a new back-end production facility for power semiconductors at its Himeji Operations – Semiconductor, in Hyogo Prefecture in western Japan. Construction will start in June 2024, with production scheduled to start in spring 2025. The project will more than double Toshiba’s automotive power semiconductor production capacity at Himeji, against fiscal 2022.
Power devices are essential components for managing and reducing power consumption in all kinds of electronic equipment, and for saving energy. Above all other products, demand for low-voltage MOSFETs (metal oxide semiconductor field effect transistors), a Toshiba focus technology, is expected to see continued growth with the progress of vehicle electrification and the automation of industrial equipment. Toshiba has decided to meet this demand growth with construction of the new back-end facility.
Going forward, Toshiba will expand its power semiconductor business and boost competitiveness by offering high efficiency, high reliability products in response to fast growing demand, and to contribute to carbon neutrality.
Overview of Himeji Operations - Semiconductor
Location: 300, Ikaruga, Taishi-cho, Ibo-gun, Hyogo Prefecture, Japan
Established: April, 1982
General Manager: Noriyasu Kurihara
Employees: Approx. 1,400 (as of April, 2022)
Main Products: Discrete semiconductors (power semiconductors and small-signal devices)
* Company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.