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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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有助於降低車載設備功耗的SOP Advance(WF)封裝的功率MOSFET產品線擴展

產品新聞 2022年1月

The package photograph of lineup expansion of power MOSFETs of SOP Advance (WF) packages that contribute to lower power consumption for automotive equipment : XPH2R106NC, XPH3R206NC.

東芝電子元件及儲存裝置株式會社 ("東芝") 已開始量產兩款採用SOP Advance (WF) 封裝的車載N通道功率MOSFET,擴展其產品線。 兩款器件型號分別為60V 「XPH2R106NC,XPH3R206NC」。

新品符合汽車可靠性標準AEC-Q101。 採用可焊錫側翼引腳結構的表面貼裝SOP Advance(WF)封裝,有利於目檢電路板上的焊接品質情況。 此外,與東芝現有產品相比,新款器件最大導通電阻降低約60%[1],有助於降低車載設備的功耗。 XPH2R106NC和XPH3R206NC是東芝首度採用SOP Advance(WF)封裝的60V產品。 元件支援各種車載應用,滿足廣泛客戶需求。

注:

[1] 新產品XPH2R106NC與現有產品TPCA8084在VGS=10 V條件下對比。

應用

車載設備

  • 電機驅動IC
  • 開關穩壓器
  • 負載開關等

特性

  • 通過AEC-Q101認證
  • 低導通電阻:
  • RDS(ON)=1.7mΩ(典型值)@VGS=10V(XPH2R106NC)
  • RDS(ON)=2.6mΩ(典型值)@VGS=10V(XPH3R206NC)
  • SOP Advance(WF)封裝採用可焊錫側翼引腳結構,有利於目檢電路板上的焊接品質情況。

主要規格

(除非另有說明, @Ta=25 °C)

器件型號

極性

絕對最大額定值

電氣特性

熱特性

封裝

漏極-源極電壓

VDSS

(V)

漏極電流

(DC)

ID

(A)

漏極電流

(脈衝)

IDP

(A)

結溫

Tch

(°C)

漏極-源極導通電阻

                  RDS(ON)

最大值

(mΩ)

結殼熱阻

Zth(ch-c)

最大值

(°C/W)

@VGS=

4.5 V

@VGS=

10 V

@Tc=
25 °C

XPH2R106NC

N溝道

60

110

330

175

4.1

2.1

0.88

SOP

Advance(WF)

XPH3R206NC

70

210

6.2

3.2

1.13

內部電路

The illustration of internal circuits of lineup expansion of power MOSFETs of SOP Advance (WF) packages that contribute to lower power consumption for automotive equipment : XPH2R106NC,XPH3R206NC.

應用電路示例

The illustration of application circuit examples of lineup expansion of power MOSFETs of SOP Advance (WF) packages that contribute to lower power consumption for automotive equipment : XPH2R106NC, XPH3R206NC.
The illustration of application circuit examples of lineup expansion of power MOSFETs of SOP Advance (WF) packages that contribute to lower power consumption for automotive equipment : XPH2R106NC, XPH3R206NC.

注:本文所示應用電路僅供參考。

特別是在量產設計階段,需要進行全面評估。

提供這些應用電路示例並不授予任何工業產權許可。

本文檔中的產品價格和規格、服務內容和聯繫方式等資訊,在公告之日仍為最新資訊,如有變更,恕不另行通知。