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Development System

The RTE900/H1 On-Chip Debug Emulation System

The RTE900/H1 On-Chip Debug Emulation System consists of Integrated Development Environment, RTE900/H1 On-Chip Debug Emulator and a communication cable. It provides various debug functions by controlling the on-chip debug function of the microcomputer mounted onto the target system.

The RTE900/H1 On-Chip Debug Emulation System

  • Capable of debugging in the operating condition equivalent to the MCU installed product.
  • Real-time PC/PD trace.
  • Trace control using an event feature.
  • Capable of referring to the memory during program execution.

 

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RTE900/H1 On-Chip Debug Emulation System Specifications
Host interface USB2.0 High-speed
Emulation memory Target memory
Event Number of points 8 points
Comparison items Address, data, status, external input
Comparison conditionscondition Match, unmatch, range
Pass count 1 to 256 times
Event trigger actions Break, trace control, timer control, external trigger output
Event combinations AND, OR, sequential
Hardware break 4 points
Software break 1024 points
Trace memory Capacity 256 frames (Notes-1)
Trace memory Modes Free trace, trigger trace, sampling trace
Trace items PC address, data address, data value, status, external output, external input, event
Trace overflow actions Overwriting, overwriting prohibit, break
Timer measurement Run timer: 1 channel, Lap timer: 1 channel
Memory access Memory display during program execution 64 bytes
Memory rewrite during program execution 1 address(byte/word/Long word either) (Notes-2)
Program variables Display Binary, octal, decimal or hexadecimal display can be selected for each variable.
Registration Variables, arrays, structures and unions can be registered by the elements.
Sauce display - Source
- Source + assembler code
- Source + assembler code + machine language
External output 1 line
External input 1 line
Performance analysis: Module time measurement -
Performance analysis: Coverage measurement -
Flash programming/security feature External Flash memory can be programmed during debugging.
(Notes-1) There are some cases where the trace memory capacity varies by a tracing condition or operating status.
(Notes-2) A break occurs whenever rewritten.

Product Configuration and Appearance of RTE900/H1 On-Chip Debug Emulator

Product Configuration

Content of Product

  • RTE900/H1 On-Chip Debug Emulator main body
  • Communication cable (already connected to the emulator main body) (Notes)
  • Communication connector (Notes)
  • One license for downloading the Integrated Development Environment from website.
(Notes) Made by Samtec,Inc.

 

Items to Be Prepared by Customer

  • Host system
  • USB cable (emulator side: B-type connector)
  • Microcomputer on the target system (with on-chip debug function incorporated)

External Dimensions

External Dimensions

  • About Connection to Target System

    Seeing the following pin assignment table, etc., lay out/mount the Communication Connector (FTSH series 20pin connector made by Samtec, Inc.) on to the target system where the On-chip debug emulation system is to be connected.
    One Communication Connector comes with an emulator, but those of the identical series (FTSH series) released from Samtec, Inc. are also available.

    FTSH-110-01-[*]-[*][*]-[*][*]

    [*] of the part number indicates a connector option. When purchasing, choose a suitable option according to its usage. For details specifications, please visit Samtec, Inc. website.

    Communication Connector attached to an Emulator
    Communication Connector attached to an Emulator
    Part Nnumber Note
    FTSH-110-01-L-DV-K Surface mount type with keying shroud
    Communication Connector Pin Assignment Table
    Communication Connector Pins vs. Signals
    Connector Pin No. Signal Name Connector Pin No. Signal Name
    1 EI_SYNCLK 2 GND
    3 EO_MCUDATA 4 GND
    5 EI_PODDATA 6 GND
    7 EO_MCUREQ 8 GND
    9 EI_PODREQ 10 GND
    11 N.C (notes-1) 12 GND
    13 N.C (notes-1) 14 GND
    15 EI_REFCLK 16 GND
    17 EO_COMRESET 18 GND
    19 DVCC3A 20 DVCC3A
    (Notes-1)
    (Notes) For the MCU pin numbers, signal names and connection method, be sure to see a data sheet for the target MCU.
    Note for Layout of Communication Cable Connector
    To monitor the waveforms of the EI_TRGIN and EO_TRGOUT signals, prepare external I/O pins on the target system as required. The following figure shows the cable pull-out direction and connector pin position, when the emulator is connected. To design the board, take into account interference with other parts at the time of connecting the communication cable. For a connector size, please visit Samtec, Inc. website.

    Points of concern in signal wiring
    To monitor the waveforms of the EI_TRGIN and EO_TRGOUT signals, prepare external I/O pins on the target system as required.
    Each debug communication signal should be connected by locating the communication cable connecor within 10 cm (4 inches) from the MCU. Especially, the EI_SYNCLK, EO_MCUDATA, EI_PODDATA, EO_MCUREQ and EI_PODREQ signals must be connected with the same length of wire. If the wire length is longer than 10 cm, or it varies greately among these signals, proper operation may not be obtained.
    All the DVCC3A and GND lines between the MCU and the communication cable connector should be as short as possible (preferably within 5 cm, within 10 cm at the longest). If the DVCC3A and GND lines are long, proper operation may not be ontained.
    The communication connector should be connected directly to the MCU pattern. If a dumping resistor is inserted between the MCU and the communication cable connector, be careful of signal delays.

  • About Emulation Operating Voltage/Frequency

    • Any operating Voltage/Frequency in the device operation assurance range is available.
    • Note that the power/clock cannot be supplied from the emulator to the target system.

  • Limitation of the On-Chip Debug Emulation

    • When connecting an on-chip debug emulator to a debug target system, communication pins and monitor pins are not available as a combined feature because they are occupied by the emulator.
    • For the operation assurance range and characteristics of the supplied power/clock, see the microcomputer's datasheet.

  • Precautions for USB Connection

    • The emulator is connected to the host system via the USB. (USB2.0 High-speed)
    • To newly connect the emulator to the host system, it is necessary to install a USB driver.

Accessory

Accessory

  • Communication Cable

    The communication cable is used to connect the emulator or the FLASH Writer to the target system. It is pre-plugged to the emulator or the FLASH Writer.
    The communication cable is available from Samtec, Inc. For detailed specifications, please visit Samtec, Inc. website.

    The recommended product can also be purchased from the following agencies.

    Communication Cable (Recommended)
    Name Part Number Remark
    Communication cable FFSD-10-D-07.00-01-N Pre-plugged to the emulator or the FLASH Writer

  • Communication Connector

    The communication connector is used to connect the emulator or the FLASH Writer to the target system. The part numbers shown below are examples. Other mount types, such as through-hole, and other mating options are also available to meet the specific needs of each customer.
    The communication connector is available from Samtec, Inc. For detailed specifications, please visit Samtec, Inc. website.

    The recommended product can also be purchased from the following agencies.

    Communication Connector (Recommended)
    Name Part Number Remark
    Communication connector
    FTSH-110-01-L-DV-K Surface mount type with keying shroud.
    Each emulator comes with one communication connector.

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