Introduction of 650V and 1200V voltage products
In common with 2nd generations, Toshiba's newest generation of MOSFETs include a built-in SiC Schottky Barrier Diode (SBD) with a low forward voltage (VF) of -1.35V (typ.), placed in parallel with the PN diode in the SiC MOSFETs, to suppress fluctuation in RDS(on) thereby enhancing reliability. Furthermore, Toshiba’s advanced SiC process[1] has greatly improved our on-resistance per unit area RonA, and the performance index Ron*Qgd, which indicates switching characteristics, compared to 2nd generation products. Also, it has easy to design gate drive circuit, and you can prevent malfunctions due to switching noise.
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Toshiba's 3rd generation SiC MOSFETs provides lower power consumption and supports higher power density for applications such as switching power supplies (servers for data centers, communication equipment), uninterruptible power supplies (UPS), PV inverters, EV charging stations etc.
2nd Generation of devices offer higher current density
With densities up to 50% higher than the first generation, Toshiba's devices and can handle significantly higher forward surge currents. The use of SiC semiconductors helps designers to improve efficiency, reduce heat dissipation and save space in high-speed power switching designs. SiC power devices also offer stable operation over a wider temperature range than silicon alternatives – even at high voltages and currents.
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VRRM (V) | IF(DC) (A) | TO-220F-2L | TO-220-2L | TO-247 |
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650 | 2 | TRS2E65F | ||
3 | TRS3E65F | |||
4 | TRS4A65F |
TRS4E65F | ||
6 | TRS6A65F |
TRS6E65F | ||
8 | TRS8A65F |
TRS8E65F | ||
10 | TRS10A65F |
TRS10E65F | ||
12 | TRS12A65F |
TRS12E65F | TRS12N65FB | |
16 | TRS16N65FB | |||
20 | TRS20N65FB | |||
24 | TRS24N65FB |
More efficient switching power supplies
The 650V-rated N-channel power MOSFETs strengthen Toshiba's latest DTMOSVI series with highly appealing performance parameters. These devices offer designers a 40% reduction in terms of their drain-source on-resistance x gate-drain charge (QGD) figure of merit (FoM) when compared to the previous DTMOS generation. As a consequence, they can raise the efficiency of switch-mode power supplies thereby enabling a substantial decrease in switching losses, compared to the previous generation
Key product:
High Voltage MOSFETS - DTMOSVI Overview
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Rds(ON) maxΩ) |
DFN8x8 |
TO-220SIS |
TO-247 | TO-247-4L | TOLL | Qg (nC) Typ. |
Ciss (VDS=300V) (pF) Typ. |
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0.19 / 0.21 | TK210V65Z | TK190A65Z | TK190U65Z | 25 | 1370 | ||
0.155 / 0.17 | TK170V65Z | TK155A65Z | TK155U65Z | 29 | 1635 | ||
0.11 / 0.125 | TK125V65Z |
TK110A65Z | TK110N65Z | TK110Z65Z | 40 | 2250 | |
0.090 / 0.099 | TK099V65Z | TK090A65Z | TK090N65Z | TK090Z65Z | 47 | 2780 | |
0.065 | TK065N65Z | TK065Z65Z | TK065U65Z | 62 | 3650 | ||
0.040 | TK040N65Z | TK040Z65Z | 105 | 6250 |
Reduction of EMI in switching power supply applications
Utilizing excellent high-speed performance, TPHR7404PU`s small 5 x 6mm SOP Advance package and extraordinary low 0.71°C/W channel-to-case thermal resistance makes the device suitable for efficiency-focused, compact power solutions. Low spike performance MOSFETs will simplify designers job and help to avoid EMI issue.
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Devices can significantly enhance power supply efficiency
TPH2R408QM and TPN19008QM are based upon Toshiba's latest generation U-MOSX-H process that exhibit a reduction of around 40% in drain-source on-resistance (Rds(ON)) compared to corresponding 80V products in earlier processes.
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TPH3R008QM | 3 mΩ | 4.9 x 6.1 mm | SOP Advance (N) |
TPH4R008QM | 4 mΩ | 4.9 x 6.1 mm | SOP Advance (N) |
TPH6R008QM | 6 mΩ | 4.9×6.1 mm | SOP Advance (N) |
TPN12008QM | 12 mΩ | 3 x 3 mm | TSON Advance |
TPN19008QM | 9 mΩ | 3 x 3 mm | TSON Advance |
TPN8R408QM | 8,4 mΩ | 3 x 3 mm | TSON Advance |
TPH8R808QM | 8.8 mΩ | 4.9×6.1 mm | SOP Advance (N) |
New devices are based on Toshiba latest low voltage generation U-MOS X-H process
TPH9R00CQH and TPH9R00CQ5MOSFET have a very low drain-source on-resistance RDS(ON) of just 9.0mΩ (max. @ VGS=10V). This represents a reduction of approximately 42% when compared to the existing 150V product (TPH1500CNH) that is based upon the current generation U-MOSVIII-H process. The new components offers two surface mount (SMD) package options – SOP Advance (5.0mm x 6.0mm) and SOP Advance(N) (4.9mm x 6.1mm) which can be selected to meet the needs of any application.
Applications:
High efficiency DC-DC convertor
Switching voltage regulator
Motor drives
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Efficient operation reduces power consumption of motor equipment
The TPD4162F is suitable for any applications with input signals in the range up to 220V AC. It contains a PWM circuit, 3-phase decoder, level shifting high-side driver and low side driver with embedded IGBTs and FRDs. Multiple protection features include current limit, over current protection (OCP), thermal shutdown and undervoltage lockout (UVLO).
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Sophisticated devices incorporate numerous protection functions
Controling IGBTs as well (SiC) MOSFETs these smart gate drivers are suitable fora wide range of applications including inverters, AC servo drives, photovoltaic (PV) inverters and uninterruptible power supplies (UPSs). They incorporate protection functions such as MOSFET and IGBT desaturation detection, active Miller clamp, U(VLO) and FAULT output, eliminating the need for several external circuits. This reduces system costs for fault detection and protection and saves space on the board and minimizes design effort. Drive strengths from +/-2.5A up to +/-4A can be supported at a wide output voltage range from 15V to 30V with low propagation delay.
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Ultra-thin SO6L package offers easy upgrade path to reduce height in designs
The use of the new photocouplers TLP5702H and TLP5705H can help simplifying designs, reducing part count and enabling miniaturisation. Whilst TLP5705H is Toshiba’s first product to deliver a peak output current rating of ±5.0A, the TLP5702H has a peak output current rating of ±2.5A. With a footprint of just 10.0mm x 3.84mm the ultra-thin SO6L package can be mounted on the PCB land pattern of a conventional SDIP6 package, facilitating an easy upgrade path for Toshiba’s current photocouplers, such as the TLP700H. The rugged devices are ideally suited to applications in industrial equipment.
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10Mbps logic output photocoupler for PLCs
The new TLP2363 is rated for a wide operating temperature range (-40 to +105°C). The threshold input current (IFHL) is specified with min. 0.3mA and max. 2.4mA thereby ensuring conformance to the digital input standard IEC 61131-2 type 1. Uniquely for this type of device, all that is required to complete the design is a bridge diode and a suitable resistor for current control. The short propagation delay of just 80ns is ideal for use with high-speed systems.
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Improve safety, cut power consumption and reduce the size of end products
Photorelays are a type of photocoupler consisting of an LED optically coupled with a MOSFET. They offer many advantages over mechanical relays such as long operational life, low-current drive and fast response. Widely used for contact switching in various industrial applications, Toshiba photorelays provide low RON, low COFF devices in various packages featuring high current and high off-state voltage.
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Ultra-low standby current consumption
Key products: TB67H450AFNG TB67H451AFNG
MIKROE ClickboardTM TB67H450AFNG
MIKROE ClickboardTM TB67H451AFNG
Check for more: Download TB67H450FNG press release (Predecessor)
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Constant rotational speed via closed-loop speed control
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Precice and efficient control of linear motion systems
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*1) Active Gain Control optimizes the drive current to suit the required torque. It´s a Toshiba technology that prevents stalls and realizes power savings.
*2) Advanced Dynamic Mixed Decay automatically optimizes switching control of fast decay and slow decay modes to secure high speed rotation. It´s a Toshiba original mixed decay technology.
Videos about Active Gain Control
Compact, efficient and flexible control for Brushless DC (BLDC) motor based power tools
The reference design combines Toshiba’s highly efficient low-voltage MOSFET devices with Toshiba’s dedicated motor control MCU and thus provides a very compact but flexible platform for the control and drive of BLDC motors in power tools. The Motor current is generated by a 3-phase inverter with 200W output power stage using the Toshiba TPH1R204PB low-voltage MOSFET. This device features industry-leading RDS(ON) in a 5×6mm SOP Advanced package and provides low spike generation helping to prevent EMI effects.
Main PCB
• Compact form factor (60 x 50 mm)
• 3-phase inverter, 200W output stage
• Speed control switch
• Pilot lamp
* sofware currently under development
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* optional support
Board picture & block diagram
* Optional support
Inverter for 3-phase motor drive and MCU for BLDC servo motor control
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Picture of reference board
Robot ARM as demo system
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TMPM4KNFYADFG Motor MCU (160MHz)
Low-Voltage TPW3R70APL MOSFET | U-MOS IX
M4K Motor Control MCU Series
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Package that contributes to the miniaturization of ECU
Highly efficient and compact devices in TSON Advance (WF) package for the first time, which ensure that board utilization is kept to a minimum.
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Check for more:
Automotive MOSFETs Product Overview
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New device is the first to be produced in Toshiba’s new U-MOS X-H series
Withstanding a drain-source voltage (VDSS) of 100V the new XK1R9F10QB is rated for a continuous drain current (ID) of 160A, or 480A if pulsed (IDP) and can be operated with a channel temperature of 175°C.
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Check for more:
Automotive MOSFETs Product Overview
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Highly efficient devices in SOP Advance (WF) package for the first time
Designed specifically for modern 48V system applications, the devices are suited to use in boost converters for integrated starter generators (ISG) and LED headlights as well as motor drives, switching regulators and load switches. They are available in a small surface mount SOP Advance wettable flanks package.
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XPH4R10ANB Power MOSFET (N-ch single 60V<VDSS≤150V)
XPH6R30ANB Power MOSFET (N-ch single 60V<VDSS≤150V)
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Higher density and less power losses
These devices meet the increasing need of the industry for smaller, efficient MOSFETs. They are part of Toshiba`s smaller package portfolio which offer a wide choice of package sizes ranging from 1x1 mm-class ultra-small packages to 3x3 mm, which contributes to miniaturization of sets by reducing the mounting area and increasing power density. By combining latest wafer processes with low-resistance packaging technologies, an industry-leading level of low on-resistance MOSFET is achieved.
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Power Factor Correction Circuit for 3-phase 400V AC Input, suitable for EV charging stations and photovoltaic inverters
An isolated bidirectional DC-DC power supply, suitable for EV charging stations and photovoltaic inverters
Stepping motor driving IC
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