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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Innovation Centre

At the Toshiba Innovation Centre we constantly strive to inspire you with our technologies and solutions. Discover how to place us at the heart of your innovations.

Package & Packing Information

We introduce package dimensions and packing methods of Toshiba semiconductor.
In developing your designs, please ensure the datasheet.

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

Discrete Device Packages

  • 3D model(.stp) : 3D model Data in STEP Format
  • Land Pattern(.dxf) : Land pattern Data in DXF Format
  • Land Pattern(.xml) : Land pattern Data in JEITA LPB C-format
  • Land Pattern(.dra) : Land pattern Data for Cadence®OrCAD®
  • Land Pattern(.ftp) : Land pattern Data for Zuken®CR-5000/CR-8000

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Package Mounting Guide

This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.