Product News 2019-07
Toshiba Electronic Devices & Storage Corporation ("Toshiba") has launched the TLP5751H(LF4), TLP5752H(LF4) and TLP5754H(LF4) which are photocoupler products using the SO6L(LF4) package that can drive gates of IGBTs and MOSFETs with small to medium capacity.
The new products have increased their operating temperature (max) to 125 °C from the 110 °C of existing products. The major characteristics have also been specified with the operating temperature ratings (Ta= -40 to +125 °C), making it easier to design and maintain a temperature margin.
The package is slim with a maximum height of 2.3 mm, helping to improve the flexibility in the layout of parts on a system board. In addition, the package can be mounted on the land pattern for our conventional products using the SDIP6(F type) package. Therefore, the products can be mounted on the back side of a board or where height is limited, replacing conventional products.
 Existing products: TLP5751(LF4), TLP5752(LF4) and TLP5754(LF4)
 Conventional products: TLP700HF and TLP701HF
 Wider lead bend package than standard package. Package height 4.15 mm (max).
Gate driver for IGBTs and MOSFETs
(Unless otherwise specified, @Ta= -40 to +125 °C)
|Peak output current IOPH, IOPL (A)||±1.0||±2.5||±4.0|
|Supply voltage VCC min/max (V)||15 / 30|
|Supply current ICCH, ICCL max (mA)||3.0|
|Threshold Input current(L/H) IFLH max (mA)||4|
|Propagation delay time tpLH, tpHL max (ns)||150|
|Propagation delay skew tpsk min/max (ns)||-80 / +80|
|Common-mode transient immunity
CMH, CML min (kV/μs)
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass-production design stage.
Providing these application circuit examples does not grant any license for industrial property rights.
Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.