Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

September 25, 2024

Toshiba Electronic Devices & Storage Corporation

Toshiba’s 1200V Additions to its Lineup of Third Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

KAWASAKI, Japan–Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added the “TRSxxx120Hx Series” of 1200V products to its lineup of third-generation silicon carbide (SiC) Schottky barrier diodes (SBD) for industrial equipment, such as photovoltaic inverters, EV charging stations and switching power supplies. Toshiba today started shipments of the ten new products in the series, five in a TO-247-2L package and five in a TO-247 package.

The new TRSxxx120Hx Series are 1200V products that use the improved junction-barrier Schottky (JBS) structure[1] of Toshiba’s third-generation 650V SiC SBD. Use of a new metal in the junction barrier allows the new products to achieve industry-leading [2] low forward voltage of 1.27V (typ.), low total capacitive charge and low reverse current. This significantly reduces equipment power loss in more higher power applications.

Toshiba will continue to expand its SiC power device lineup, and to focus on improving efficiency that reduces power loss in industrial power equipment.

Notes:
[1] Improved JBS Structure: A structure that incorporates the Merged PiN Schottky (MPS) structure, which reduces forward voltage at high currents, into the JBS structure, which lowers the electric field at the Schottky interface and reduces current leakage.
[2] Among 1200V SiC SBDs. As of September 2024, Toshiba survey.

Applications

  • Photovoltaic inverters
  • EV charging stations
  • Switching power supplies for industrial equipment, UPS

Features

  • Third-generation 1200V SiC SBD
  • Industry-leading [2] low forward voltage: VF=1.27V (typ.) (IF=IF(DC))
  • Low total capacitive charge: QC=109nC (typ.) (VR=800V, f=1MHz) for TRS20H120H
  • Low reverse current: IR=2.0μA (typ.) (VR=1200V) for TRS20H120H

Main Specifications

(Unless otherwise specified, Ta =25°C)

Part number Package Absolute maximum ratings Electrical characteristics Sample Check &
Availability
Repetitive peak reverse
voltage
VRRM
(V)
Forward
DC
current
IF(DC)
(A)
Non-repetitive
peak forward
surge current
IFSM
(A)
Forward voltage
(pulse measurement)
VF
(V)
Reverse current
(pulse measurement)
IR
(μA)
Total capacitive charge
QC
(nC)
  Temperature conditions
Tc
(°C)
f=50Hz
(half-sine wave, t=10ms),
Tc=25°C
IF=IF(DC) VR=1200V VR=800V, f=1MHz
Typ. Typ. Typ.
TRS10H120H TO-247-2L 1200 10 160 80 1.27 1.0 61 Buy Online
TRS15H120H 15 157 110 1.4 89 Buy Online
TRS20H120H 20 155 140 2.0 109 Buy Online
TRS30H120H 30 150 210 2.8 162 Buy Online
TRS40H120H 40 147 270 3.6 220 Buy Online
TRS10N120HB TO-247 5 (Per leg)
10 (Both legs)
160 40 (Per leg)
80 (Both legs)
1.27
(Per leg)
0.5
(Per leg)
30
(Per leg)
Buy Online
TRS15N120HB 7.5 (Per leg)
15 (Both legs)
157 55 (Per leg)
110 (Both legs)
0.7
(Per leg)
43
(Per leg)
Buy Online
TRS20N120HB 10 (Per leg)
20 (Both legs)
155 70 (Per leg)
140 (Both legs)
1.0
(Per leg)
57
(Per leg)
Buy Online
TRS30N120HB 15 (Per leg)
30 (Both legs)
150 105 (Per leg)
210 (Both legs)
1.4
(Per leg)
80
(Per leg)
Buy Online
TRS40N120HB 20 (Per leg)
40 (Both legs)
147 135 (Per leg)
270 (Both legs)
1.8
(Per leg)
108
(Per leg)
Buy Online

Follow the links below for more on Toshiba's SiC SBDs.

SiC Schottky Barrier Diodes

3rd generation SiC Schottky barrier diode (SBD)

Follow the link below for more on Toshiba’s SiC Power Devices.

SiC Power Devices

To check availability of the new products at online distributors, visit:

TRS10H120H
Buy Online

TRS15H120H
Buy Online

TRS20H120H
Buy Online

TRS30H120H
Buy Online

TRS40H120H
Buy Online

TRS10N120HB
Buy Online

TRS15N120HB
Buy Online

TRS20N120HB
Buy Online

TRS30N120HB
Buy Online

TRS40N120HB
Buy Online

Customer Inquiries:

  Power & Small Signal Device Sales & Marketing Dept.I

  Tel: +81-44-548-2216

* Company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

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