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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Managing and Cutting Down on Chemicals

Efforts are of course made to limit the use of harmful chemical substances as much as possible and to find alternative harmless chemical substances, and consumption of chemical substances is reduced (optimization of consumption) by improving productivity through improving the manufacturing process and yield. We are also working to minimize the impact on the global environment of chemical substances by reusing and recycling them after use and detoxifying by way of exhaust gas treatment and wastewater treatment.
The reduction of environmental risk is promoted by taking actions that tackle both aspects of use as well as emission and disposal of chemical substances through reductions, thereby contributing to the protection of our global environment.

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Example case: Reduction of the amount of chemical substances used and emissions in semiconductor manufacturing process (Resist coating optimization)

Toshiba Electronic Devices & Storage Corporation Himeji Operations – Semiconductor
Japan Semiconductor Corporation Headquarters & Iwate Operations / Oita Operations
Kaga Toshiba Electronics Corporation

Example case : Reduction of the amount of chemical substances used and emissions in semiconductor manufacturing process (Resist coating optimization)

For the amount of chemicals used in the resist process of the semiconductor manufacturing process (front-end), we reduced the amount of chemical substances used and emissions by examining the optimum conditions for each process and piece of equipment in order to apply this to a wide variety of products.

Reduction rate of chemical substances: Reduction of up to 52%/Year (Year-on-year)
Japan Semiconductor Corporation Headquarters & Iwate Operations

* Please click the following button about the target/result of “Reduce chemical substance discharge” from FY2017 till FY2020.

Targets and actual results for environmental performance

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