Toshiba Introduces Compact Photorelays with Improved Isolation Voltage of 3.75kV
May 2, 2017
4-pin SO6 Packages Capable of Withstanding Operating Temperatures of up to 110°C
IRVINE, Calif., -- Toshiba America Electronic Components, Inc. (TAEC)* today announced that it has expanded its extensive portfolio of photorelays with the addition of two 4-pin SO6 package products. The new TLP172AM and TLP172GM operate at temperatures up to 110°C, feature an isolation voltage of up to 3750Vrms and have a 3mA (max) trigger current. This makes them suitable for use as function switches in measuring equipment, sensor switches in security systems, power monitoring function in battery management systems, IoT equipment and more.
The new photorelays are halogen-free1 and are made with a double mold structure. The TLP172AM and TLP172GM utilize multi-chip technology and were developed as high spec, pin-compatible versions of Toshiba’s existing 2.54SOP package products (TLP172A, TLP172G). The new devices satisfy designers’ requirements for thin packages that comply with high levels of safety standards.
Offering on/off control for high-current applications, the TLP172AM features a higher current output rating than phototransistor photocouplers. The TLP172GM can be used in space-constrained battery management systems.
Main Specifications
New Products |
Existing Products |
New Products |
||
|---|---|---|---|---|
TLP172A |
TLP172G |
TLP172AM |
TLP172GM |
|
Contact |
1 Form A |
|||
Package |
2.54SOP4 |
4-pin SO6 |
||
TOPR |
-40 to 85 degrees Celsius |
-40 to 110 degrees Celsius |
||
IFT (max) |
3mA |
|||
VOFF (min) |
60V |
350V |
60V |
350V |
RON (max) |
2Ω |
50Ω |
2Ω |
50Ω |
ION(max) |
0.4A |
0.11A |
0.5A |
0.11A |
Pulsed ION(max) |
1.2A |
0.33A |
1.5A |
0.33A |
BVs(min) |
1500Vrms |
3750Vrms |
||
tON(max) |
2ms |
1ms |
2ms |
1ms |
tOFF(max) |
0.5ms |
1ms |
0.5ms |
0.5ms |
Package Dimensions and Land Patterns
Pricing and Availability
The new photorelays are available now. For more details, samples and pricing information, please contact your local Toshiba Sales Office.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, and advanced materials that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor, solid state drive and hard disk drive manufacturer and the world’s seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 550 consolidated companies employing over 188,000 people worldwide (as of March 31, 2016). Visit Toshiba's web site at http://toshiba.semicon-storage.com.
1Toshiba defines halogen-free and antimony-free products as those meeting all of the following requirements: (a) containing bromine (Br) and chlorine (Cl) at no more than 900 parts per million (ppm) by weight for each element, and containing bromine and chlorine in an aggregate amount not exceeding 1500 ppm by weight; and (b) containing no more than 1000 ppm antimony (Sb) by weight. For the avoidance of doubt, halogen-free/antimony-free products may not be entirely free of bromine, chlorine, or antimony, and may contain other elements of the halogen family.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.