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Toshiba Expands Lineup of Photorelays in DIP8 Packages

August 3, 2017

Adds 100V, 200V Options with High Drive Currents


IRVINE, Calif., --- Toshiba America Electronic Components, Inc. (TAEC)* has added two mid-voltage products, the 100V TLP3823 with a 3A drive current, and the 200V TLP3825 with a 1.5A drive current, to its lineup of large current photorelays. The new products can be used to replace mechanical relays in applications including industrial equipment, general purpose inverters, HVAC, thermostats, building automation equipment, semiconductor testers, and more. The new photorelays are housed in 8-pin DIP packages, and are available with both Gull Wing (SMD) and wider creepage options.

The rate at which photorelays are being used to replace mechanical relays has accelerated in recent years. Toshiba is supporting and promoting this shift by applying its latest trench MOSFET process technology – 8th generation UMOS – to enable output currents that exceed 1A. Unlike mechanical relays, photorelays have no physical contacts subject to wear and tear, an advantage that can lead to greater product reliability. The use of photorelays also supports the development of smaller and thinner products. Toshiba’s new photorelays also offer the advantage of a guaranteed pulsed on-state current that is three times larger than that of a continuous on-state current, ensuring a bigger margin for design safety.

Features

  • TLP3823: VOFF=100V(min), ION=3A(max), ION(pulse)=9A(max)@t=100ms, Duty=1/10
  • TLP3825: VOFF=200V(min), ION=1.5A(max), ION(pulse)=4.5A(max)@t=100ms, Duty=1/10

Main Specifications

(@Ta=25°C)

 

 

 

 

Part Number

 

Absolute Maximum Rating

On-state Resistance

 

Trigger LED

current IFT

max (mA)

 

 

Off-State Current IOFFmax (µA)

@VOFF (V)

 

 

Turn-On time tON typ. (ms)

 

 

Turn-Off Time tOFF

typ.

(ms)

 

 

 

 

Package

Off-state output terminal Voltage VOFF

(V)

 

On-state Current ION

(A)

 

On-state current (pulsed) IONP

(A)

 

 

Isolation voltage BVS

(Vrms)

 

 

RON

typ. (mΩ)

 

 

RON

max (mΩ)

TLP3823

 

100

 

3

 

9

 

2500

 

60

 

150

 

   5

1 (@VOFF= 100(V))

 

1.5

 

0.1

DIP8

TLP3825

 

200

 

1.5

 

   4.5

 

2500

 

250

 

500

 

   5

1
(@VOFF= 200(V))

 

0.25

 

0.1

Pricing and Availability

Mass production of the new photorelays has commenced. For more details, samples and pricing information, please contact your local Toshiba Sales Office.

*About About Toshiba and Toshiba America Electronic Components, Inc. (TAEC)

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.   

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc. For over 140 years, Toshiba Corporation has contributed to a sustainable future by applying innovative technologies to value creation. Today, our business domains are centered on the essential infrastructure that supports modern life and society. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations that contribute to realization of a world where generations to come can live better lives.

To find out more about Toshiba, visit www.toshiba.co.jp/worldwide/about/index.html

 


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

 

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