Toshiba Starts Construction of 300-milimeter Wafer Fabrication Facility for Power Semiconductors
April 24, 2023
Toshiba Electronic Devices & Storage Corporation
KAWASAKI, Japan – Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced that it has started construction of a new wafer fabrication factory for power semiconductors at Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture, Japan, its main discrete semiconductor production base. Construction will take place in two phases, with the production start of Phase 1 scheduled for within fiscal 2024. Toshiba will also construct an office building adjacent to the new fab to respond to the increase in personnel.
The new fab will have a quake absorbing structure and enhanced BCP systems, including dual power supply lines, and also aim to use 100% renewable energy. Product quality and production efficiency will be improved by introducing artificial intelligence systems and other measures.
Toshiba started power semiconductor production on a 300-milimeter wafer line in the second half of fiscal 2022. Going forward, Toshiba will expand production capacity of power semiconductors with the new fab and further contribute to carbon neutrality.
Artist’s impression of the new 300-milimeter wafer fabrication facility, Kaga Toshiba Electronics (the building in front, upon the completion of Phase 2)
Overview of Kaga Toshiba Electronics Corporation
Location: 1-1, Iwauchi-machi, Nomi-shi, Ishikawa Prefecture, Japan
Establishment: December, 1984
President and Representative Director: Hideo Tokunaga
Employees: Approx. 1,000 (as of September 30, 2021)
Main Products: Discrete semiconductors (power semiconductors, small-signal devices and optoelectronic devices)
Toshiba to Expand Power Semiconductor Production Capacity with 300-millimeter Wafer Fabrication Facility, February 4, 2022
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.