February 15, 2010
Bridge Chip Connects Advanced Baseband or Application Processors to High Resolution Displays with Parallel Interfaces
SAN JOSE, Calif., — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new deserializer display bridge chip (TC358762XBG). The device connects the baseband or application processors used in smart phones, which use Mobile Industry Processor Interface-Display Serial Interfaces (MIPI®-DSI), to displays with legacy parallel interfaces. This capability allows OEMs to implement the power of an advanced mobile processor in other mobile applications beyond smart phones where high-resolution displays with parallel interfaces are more commonly used. This deserializer bridge chip, along with three other bridge chips announced today, is the latest addition to the Toshiba Mobile Product Initiative portfolio of mobile peripheral devices designed to help customers implement more advanced technologies in their handheld products.
"Toshiba's mobile peripheral devices are a family of connectivity chipsets that enable flexibility in mechanical design, a broader selection of major components such as displays and cameras, reduction in power consumption, and reduction in EMI issues in handheld devices such as smart phones, mobile internet devices, netbooks, smartbooks, eBooks, and personal media and navigation devices," said Deepak Prakash, director, Digital Multimedia Business Development in the ASSP Business Unit at TAEC. "The TC358762XBG deserializer bridge chip uses the MIPI high-speed serial interface to deliver the large data bandwidth needed for displaying high-resolution video content."
The TC358762XBG deserializer bridge chip is targeted for use with high-resolution display panels HVGA, VGA, WVGA, qHD, and XGA. It supports video input frame rates of up to 60 frames per second for XGA and 30 frames per second for 720P. It uses a dual-lane DSI receiver that is bi-directional at lane 0 and supports data rates of up to 800 Mbps per lane for total data bandwidth of 1.6Gbps. The chip's DPI host has a bus speed of up to 70 MHz burst rate. The device can also be used to connect pico projectors to baseband and application processors to enable embedded digital projector applications in mobile devices. The TC358762XBG bridge chip has been thoroughly tested for interoperability with the ARMADAT 610 application processor by Marvell® and is included in Marvell's ARMADA 610 reference design.
"Toshiba's TC358762XBG deserializer bridge chip offers designers the ability to add greater flexibility and increased functionality to Marvell based designs such as those using the recently announced ARMADA 610 application processor," said Rajeev Kumar, Director, Applications Processor Business Unit at Marvell Semiconductor. "OEM's today are demanding uncompromised experiences including High Definition 1080P video on mobile devices, the combination of Marvell ARMADA application processors and Toshiba's deserializer chip allow for even greater capability."
Engineering samples of the TC358762XBG deserializer bridge chip are available now, with mass production scheduled to begin in March 2010. The device is priced at $1.50 per unit in 10,000 unit quantities.
Toshiba's Mobile Product Initiative, announced in 2007, combines an expanded product portfolio, support tools (color tuning, reference designs and evaluation boards,) to help TAEC customers address tough issues facing the current and future mobile handset/portable consumer electronics designs, including system integration, emerging standards and interoperability. Additionally, TAEC provides local application and design-in support and access to a host of analog peripheral ICs from other Toshiba divisions and business units, including the Toshiba Dynastron CMOS image sensor/module family, I/O expanders, memory products and display panels.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributions and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, Preliminary 2009 WW Semiconductor Revenue Ranking, January 2010). For additional company and product information, please visit http://www.toshiba.com/taec/.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at chips.toshiba.com or from your TAEC representative.
MIPI is a licensed trademark of MIPI Alliance, Inc. in the U.S. and other jurisdictions. Marvell is a registered trademark of Marvell and/or its affiliates. ARMADA is a trademark of Marvell and/or its affiliates.
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