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Toshiba Introduces Series of Nch Standard MOSFETs for Mobile Devices

July 26, 2011

Ultra Small Diversified Packages, Low On-Resistance MOSFETS Operate at Low Voltage and Maintain 250mA Drain Current


IRVINE, Calif., — Toshiba America Electronic Components, Inc., (TAEC)* has announced the addition of the SSM3K37 series of Nch Standard MOSFETs for mobile devices. Consisting of the SSM3K37MFV, SSM3K37FS, SSM3K37CT, SSM6N37FU, SSM6N37FE, and SSM6N37CTD , this new generation of SSM3K16 series for standard switches is designed for mobile devices addressing power consumption issues and physical size restrictions that are important in the design of mobile devices.

The SSM3K37 series of MOSFETs is available in very small packages and offers a very low RDSon. Small package size allows for more compact circuit designs and therefore mobile devices that are smaller in size. Combined with a 250mA drain current, low on-resistance enables the MOSFET to run more efficiently, allowing batteries to last for longer periods of time.

Additionally, Toshiba's SSM3K37 series of MOSFETs are able to be driven at voltages as low as 1.5V - a voltage that batteries in most mobile devices can provide. The devices are also able to be operated at high frequencies, and are suitable for high speed switching applications.

According to Talayeh Saderi, business development engineer for TAEC, "These transistors are capable of acting as a switch to control which loads are connected or disconnected from the circuit. Like flipping a light switch, one can apply a voltage to the transistor to electrically connect (or disconnect) parts of a circuit."

A large range of package sizes including SSM, VESM, CST3, US6, ES6, CST6D (with the smallest being the CST3 at 0.6 x 1.0mm), enable these devices to be adapted to a variety of different size requirements.

Features of the SSM3K37 series include:

  • VDSS = 20V
  • VGSS = ±10V
  • ID = 250mA
  • RDS (max)@(VGS =-1.5V) = 5.60 Ω
  • RDS (max)@(VGS =-1.8V) = 4.05Ω
  • RDS (max)@(VGS =-2.5V) = 3.02Ω
  • tON (typ) = 18 ns
  • tOFF (typ) = 36 ns
  • CISS (typ) = 12 pF

Availability

The Toshiba SSM3K37 series of Nch Standard MOSFETs is available now.

Toshiba's Discrete Products

Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, photocouplers, Toslinks TM , LEDs, small signal diodes and transistors.  The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, Jan. 2011). Toshiba was founded in 1875, and today operates a global network of more than 740 companies, with 204,000 employees worldwide and annual sales surpassing $77 billion.

For additional company and product information, please visit http://www.toshiba.com/taec/.


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba’s “Handling Guide for Semiconductor Devices,” or "Toshiba Semiconductor Reliability Handbook."” This information is available at www.chips.toshiba.com, or from your TAEC representative.

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