August 10, 2011
New MOSFET Technology Delivers Improved Performance and Reliability in Pin-to-Pin Compatible Packaging
IRVINE, Calif., — Toshiba America Electronic Components, Inc. (TAEC)* has announced a new range of power MOSFETs that combine the company's latest trench MOS process with its enhanced DPAK+ package technology. The new MOSFETs will significantly improve application performance while reducing PCB real estate and noise. The new products are ideally suited for a range of applications, including switching regulators, DC-DC converters and motor drives.
Toshiba's new MOSFET line-up comprises 11 n-channel devices that offer a choice of maximum voltage ratings of 40V, 60V and 100V, and ten p-channel parts with maximum voltage ratings of -40V and -60V. Current ratings range from ±8A to ±80A depending on the device chosen. All of the MOSFETs are designed to operate in environments with channel temperatures of up to 175 degrees Celsius.
The DPAK+ package has the same form factor as, and is pin-to-pin compatible with, conventional DPAK packages. However, its proprietary internal design reduces resistance and thermal losses and ensures improved efficiency, current handling and reliability when compared with conventional DPAK alternatives.
Based on Toshiba's proven 'WARP' technology, DPAK+ replaces conventional internal aluminium bondwires between the MOSFET die and the package leads with wider copper clamps. The clamping mechanism maintains a highly reliable mechanical connection capable of withstanding repeated power cycling as well as exposure to shock and vibration.
In addition, the larger cross-sectional area, combined with higher electrical connectivity, minimizes I2R heating due to package losses and also reduces package inductance. This, in turn, contributes to heat reduction, lower noise and faster device operation.
MOSFETs in the new DPAK+ family have low leakage currents and ultra-low resistances, as low as 2.4mΩ (typical, VGS=10V). Typical thermal resistance between channel and case is only 1.5 degrees Celsius/W, while power dissipation at 25 degrees Celsius is just 100W.
|Maximum Ratings||RDS(ON) /max (m Ω )|
The Toshiba DPAK+ MOSFETs are in mass production and available now.
Toshiba is a leading supplier in a number of discrete product categories, including power transistors, rectifiers and thyristors, LMOS logic, CMOS logic, photocouplers, Toslinks™, LEDs, small signal diodes and transistors. The company's discrete devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, while emphasizing its strength in the automotive and industrial markets.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, discrete devices, displays, advanced materials, medical tubes, custom SoCs/ASICs, digital multimedia and imaging products, microcontrollers and wireless components that make possible today's leading cell phones, MP3 players, cameras, medical devices, automotive electronics and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2010 WW Semiconductor Revenue, Jan. 2011). Toshiba was founded in 1875, and today operates a global network of more than 740 companies, with 204,000 employees worldwide and annual sales surpassing $77 billion.
For additional company and product information, please visit http://www.toshiba.com/taec/.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.
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