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Toshiba Introduces New High-Frequency Power Detection IC for Mobile Phones

August 21, 2012

Utilizes RMS Detection for Transmission Power Control in UMTS, CDMA, WCDMA and LTE


IRVINE, Calif., — Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the introduction of the new TCX4A01WBG, a high-frequency power detection integrated circuit (IC) that uses Root Mean Square (RMS) detection for transmission power control in mobile phones.

The small circuit area of the new chip enables high efficiency operation for power amplifiers, and extends battery life - a key concern in the design of today's mobile phones. Toshiba's TCX4A01WBG features an ultra-small package (WCSP4), operating with only a coupling capacitor and a bypass capacitor.

The new power detection IC from Toshiba can extract a high accuracy detection voltage from even the most complex transmission signals - such as those used for 3G or newer phones - and is also suitable for PA power control. Additionally, the chip gives greater freedom in circuit design, which is especially important at a time when multiple bands and complex transmission signals are present due to an increase in data communication demands.

"Today's mobile phones require high-frequency power detection with a small circuit area. The ability to achieve a long battery life is one of the most pressing issues in the design of mobile phones, and has become a consumer expectation," noted Talayeh Saderi, business development engineer for TAEC. "Because the power amplifier consumes considerable power in a mobile phone, having control for the power amplifier is essential."

Features include:

  • Extracts a high-accuracy detection voltage from even complex modulation signals
  • Uses Root Mean Square (RMS) detection
  • Single-power operation in the 2.5 to 3.3 V range
  • Low power consumption of 0.95 mW (typ.)
  • Ultra-small package WCSP (0.79 mm x 0.79 mm x 0.5 mm)
  • A small number of peripheral circuit parts: operates with only a coupling capacitor and a bypass capacitor
  • Suitable for UMTS, CDMA, WCDMA and LTE mobile phone technologies

Main Specifications

Parameter Symbol Measurement conditions Min Typ. Max Unit
Operating frequency Icc No input signal - 0.34 0.5 mA
Operating frequency f   700 - 2000 MHz
Error ER

f=900MHz,Pin=-15 to 0dBmf

-0.3 - +0.3 dB
Dynamic range DR f=900MHz, Error ±1.0dB - 27 - dB
Conversion gain Gc

f=900MHz, Pin=-15 to 0dBm

77 85 93 mV/dB
Error temperature factor KERROR f=900MHz, P in =-5dBm, Ta=-25 to +85°C

Pricing and Availability

Toshiba's TCX4A01WBG is currently available with sampling pricing at approximately $0.40/unit. For datasheets and samples , please contact your Toshiba representative.

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, MP3 players, cameras, medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's third largest semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue, March, 2012). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba'’s "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.

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