May 28, 2013
Company's Newest Vector Motor Control MCU Benefits Variable-Speed Brushless DC Motor Control Applications Like Data Center Cooling Systems
SAN JOSE , Calif., – Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today expands the Toshiba TX03 series microcontroller (MCU) family with the launch of its newest TMPM375FSDMG device. Based on the ARM® Cortex®-M3 core, the TMPM375FSDMG MCU implements a next-generation vector engine that improves motor control, reduces component count, energy, and power consumption. The MCU is ideal for Brushless DC (BLDC) motor control applications like fan and pump cooling systems, industrial compressors, printers, and motorized tools that require high reliability, operational efficiencies, and precise variable speed control.
"Today's announcement highlights the value proposition of the Toshiba TX03 series of microcontrollers," says Andrew Burt, vice president of the Analog and Imaging Business Unit, System LSI Group at TAEC." The TMPM375FSDMG delivers precise speed control for smooth and quiet operation, efficient use of energy and effective management of torque enabled in a very small footprint." He continues, " The MCU is great for deployment in data and telecom centers that are expanding exponentially to support cloud-based computing. The cooling systems in these centers play a critical role in managing operational power and cost expenditures. The TMPM375FSDMG helps these types of cooling systems run more efficiently and cost effectively."
The TMPM375FSDMG lowers system cost for field-oriented control by reducing component count– the analog front end has been removed and 5V operation cancels the need for a 3V regulator. The combination of an industry-standard ARM Cortex-M3 CPU, with the specialized vector engine and high-speed timers, eliminates a costly DSP, further lowering cost-of-entry for field-oriented motor control. Lastly, the microcontroller supports a built-in amplifier for single-shunt current detection that can reduce the number of parts and promote cost reduction.
The TMPM375FSDMG's very small SS0P30 package (7.6 mm x 10 mm, including pins), and the reduced component count, make it well suited for space-critical applications. The device is capable of high-speed operation (25 ns PWM), and its extended temperature range of -40° to +105° enables the MCU to be uses in a wide range of industrial applications.
Sample pricing for the TMPM375FSDMG is $3.50 (U.S.). Samples will be available by the end of June 2013, with mass production scheduled to begin later in 2013.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. s an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp or from your TAEC representative.
ASSP 13 677