September 25, 2013
Industry-First Chipset Converts HDMI Signal to MIPI DSI, so Application Processors Can Interface to Small-Form-Factor LCD Displays
SAN JOSE , Calif., – Toshiba America Electronic Components, (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today adds a new part to its Display Serial Interface (DSI) chipset family. The TC358779XBG. This newest product is a High Definition Multimedia Interface (HDMI®) to MIPI® DSI converter chipset with video de-interlacing, scaling, and format conversion. This is the first and only device in the market that enables HDMI video output to be converted and processed as a MIPI DSI video stream for small form-factor LCD displays in many consumer and industrial applications.1
"The TC358779XBG provides design, performance and cost benefits making it an ideal solution for smaller mobile, consumer electronics and industrial products with an LCD display requiring MIPI DSI input," says Deepak Prakash, senior director for the Logic LSI Business Unit, System LSI Group at TAEC. "Application processors can continue to interface to traditional larger displays, and now can easily drive LCDs with DSI that are ubiquitous on mobile devices, digital cameras and gaming accessories, and will become ubiquitous on wearable computers like head-mounted products."
With new LSI video processing, de-interlacing and scaling, the TC358779XBG significantly reduces the memory bandwidth and video processing requirements on the host processor. Up-down scaling and color-space conversion allows output from the application processor to be formatted and scaled to match the display panel's output resolution and color format.
The maximum resolution supported is 1920 x 1200 @ 24 bpp at a refresh rate of 60 fps. The device supports common 3D video formats and protocols compatible with the HDMI 1.4 standard. The TC358779XBG supports a MIPI DSI interface up to 4Gbps to an LCD display panel with configurable 1, 2, 3, or 4 data lanes with lane speeds of up to 1 Gbps per lane.
The Toshiba TC358779XBG is an 80-pin device for non-HDI boards with a small package size of 7.0 x 7.0 mm, 0.65 mm ball pitch and 1.0 mm maximum height.
Sample pricing for the TC358779XBG device is $5.00 (U.S.). Sample shipments are currently available with mass production scheduled for December, 2013.
*About Toshiba Corp. and TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, advanced materials, medical tubes, custom SoCs/ASICs, imaging products, microcontrollers and wireless components that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's fifth largest semiconductor manufacturer (Gartner, 2012 Worldwide Semiconductor Revenue, April, 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
HDMI is a registered trademark of HDMI Licensing, LLC in the United States and/or other countries.
MIPI is a registered trademark of MIPI Alliance, Inc.
1Source: Toshiba America Electronic Components, Inc., research as of 9/25/13.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at http://www.toshiba.com/taec/support/techquestions/index.jsp or from your TAEC representative.
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