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Toshiba Launches Image Recognition Processor for Ultra-Small Camera Modules

May 27, 2014

Targeted to Automotive OEMS; Realizes Fast, Accurate Image Detection

SAN JOSE, Calif., — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with leading technology companies to create breakthrough designs, has expanded its series of image recognition processors with the launch of the TMPV7502XBG. Toshiba has designed the TMPV7502XBG for miniaturized camera modules - featuring a one-channel video input interface, its small (11mm x 11mm) package and low power consumption (Typ. 0.6W1) design are ideal for use in today's small camera modules.

The new TMPV7502XBG is suited for use in advanced driver assistance systems (ADAS), which identify and recognize oncoming and surrounding vehicles and pedestrians from the in-vehicle cameras. Offering fast, accurate image detection, the TMPV7502XBG is capable of performing multiple detections simultaneously, such as a lane departure warning, collision warning, pedestrian detection and traffic sign recognition.

The TMPV7502XBG's small package size enables it to be integrated directly into the camera module, simplifying installation and reducing cost.

In response to the expanding market for image recognition equipment - which is expected to grow to $740 million to $985 million in 2015 2 , Toshiba first commercialized an image recognition processor in 2004. Today, the company's TMPV750 series of image recognition processors includes a wide range of offerings, geared towards making drivers more aware of potential hazards.

TMPV7502XBG's fast and accurate image recognition is achieved through multi-core processor architecture and multiple video processing engines. Toshiba's 30-years of experience in advanced image processing technology, extensive processor expertise and mixed-signal semiconductor manufacturing know-how have combined to enable the integration of these advanced solutions into a single package.

"The popularity of advanced driver assistance systems is growing - they are a key selling point in today's car market," said Deepak Mithani, director mixed signal business unit, system LSI group for TAEC. "With the introduction of the TMPV7502XBG, we have drawn on our decades of experience and manufacturing advantages to integrate all of the technologies necessary for a successful ADAS system into one small package."

Pricing and Availability

Samples of the TMPV7502XBG are currently shipping, with mass production scheduled to commence in November 2014. Reference pricing begins at $35 (3,500 Yen)3.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, December 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 206,087 employees worldwide. Visit Toshiba's web site at

For additional company and product information, please visit

1Measured value

2Survey by Toshiba

3Conversion= $1/100Y

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at , or from your TAEC representative.

ASSP 14 712

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