April 29, 2014
Enhances Performance; Reduces Mounting Area
IRVINE, Calif., — Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced a new small package size, high-current (3.3A max.) photorelay - the TLP3107. Housed in a small 2.54SOP6 package, the low on-state resistance and high permissible on-state current of the TLP3107 make it suited to testing applications, including power-line switching, feedback resistance switching and measuring-line switching.
Photorelays provide design engineers with fast switching speed, high reliability, lower power consumption, and noise-free operation in a space-saving package, making them an alternative to mechanical relays. Consisting of a photo MOSFET optically coupled to an infrared light emitting diode, the new photorelay utilizes the latest generation trench MOSFET to realize an approximately 1.4 times higher on-state current than Toshiba's existing product, the TLP3103. This performance, combined with a 3.3A (max.) output, will accelerate the replacement of mechanical relays in applications that require high density assembly. Replacing a 3A-capable DIP package with the 2.54SOP6 package reduces the assembly area by 40 percent, and the overall product height by half.
Body size: 6.3 x 4.4mm
(Including lead: 6.3 x 7.0mm)
|On-state Current||3.3A (max.)|
|On-state Resistance||0.04Ω (typ), 0.07Ω (max.)|
|Off-state Voltage||60V (min.)|
|Off-state Current (Photo Side)||10nA (max.)|
|Trigger LED Current||3mA (max.)|
|Isolation Voltage||1500Vrms (min.)|
Mass production of the new photorelay has begun. Please contact your local Toshiba Sales Office for samples and pricing.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, December 2013). Toshiba Corporation was founded in 1875 and today has over 554 subsidiaries and affiliates, with 206,087 employees worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec.
Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
OPTO 14 709