Toshiba Introduces Industry-First 4K2K Embedded DisplayPort™ (eDP™)-To-MIPI® Dual-DSI Bridge Chipset
November 18, 2014
New chipset to help drive innovation for tablets, phablets and handheld gaming devices
SAN JOSE, Calif., — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today unveiled the industry's first1 Embedded DisplayPort™ (eDP™)-to-MIPI® dual-Display Serial Interface (DSI) converter chipset. The new TC358860XBG chipset enables the 4K2K ultra high definition (UHD) experience for handheld electronic devices such as tablets, phablets and portable gaming systems.
"In the high-performance, feature-driven mobile market, consumers are always looking for the next big thing," said Deepak Prakash, senior director for the Logic LSI Business Unit, System LSI Group at TAEC. "By creating this chipset that enables 4K resolution displays to operate at low power, Toshiba will help ensure that the next generation of handheld products delivers the most advanced, highest-definition viewing experience available."
The TC358860XBG chipset incorporates both video format conversion and compression technology to support 4K2K high-resolution displays. Employing both high-speed serial interface industry standards with low power operation capability in one chip enables UHD 4K displays while maintaining handhelds' low power consumption requirements. The chipset also delivers the high refresh rates - beyond 60 frames per second (fps) - needed to enable a "living room" quality gaming experience in a handheld gaming system.
The TC358860XBG provides eDP incoming data (RX) support for VESA eDP v1.4. This includes eight types of bitrate support, ranging from 1.62 to 5.4 Gbps; maximum 1Mbps AUX channel support; and native and I2C-over-AUX transaction support. On the outgoing data side, the chipset supports MIPI dual-port DSI with maximum 1.0Gbps/lane link speed interface and a total data transfer capability of 8Gbps. The device is housed in a 5.0 x 5.0 mm FBGA65 package with 0.5mm ball pitch.
Availability
TC358860XBG chipset samples are available now; mass production will begin in March 2015.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
1Based on Toshiba research as of November 18, 2014
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.
DisplayPort and eDP are trademarks of the Video Electronics Standards Association (VESA) and MIPI is a trademark of the MIPI Alliance, Inc. in the U.S. and other jurisdictions.
APIC 14 730