Toshiba Introduces New Low-Height Transistor Output Photocoupler
November 26, 2014
Offers Wider Creepage Distance; Suited to Applications with Strict Height Requirements
IRVINE, Calif., — Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of a new transistor output photocoupler in a low-height SO6L 4 pin package - the TLP385. With its low-height of 2.3mm (max), 45 percent lower than DIP4 packages, the TLP385 can be used in situations with strict height requirements. Applications including motherboards, programmable logic controllers, AC adapters, I/O interface boards, inverter interfaces and general purpose power supplies are suited to the new photocouplers.
Toshiba's new photocoupler has an isolation specification equivalent to DIP4 F (wide lead) type package products, and provides a creepage and clearance distance of 8mm (min) and isolation voltage of 5kVrms (min).
According to Joseph Tso , business development manager for TAEC's optoelectronics group, "Our TLP385 is a great choice for high density surface mounting applications, and as a replacement for conventional DIP4 pin package products."
Key Specifications
| Part number | TLP385 |
|---|---|
| Current Transfer Ratio (CTR [Note]) | 50 to 600%@IF=5mA, VCE=5V |
| Turn-off (tOff) | 40 µs (typ.) @IF=16mA |
| Operating Temperature Range (Topr) | -55 to 110 °C |
| Isolation Voltage (BVs) | 5kVrms |
| Safety Standard | UL, cUL, VDE, CQC |
The new transistor output photocouplers are available now. For more details, samples and pricing information, please contact your local Toshiba Sales Office.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today's leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan's largest semiconductor manufacturer and the world's sixth largest semiconductor manufacturer (Gartner, 2013 Worldwide Semiconductor Revenue, April 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
For additional company and product information, please visit http://www.toshiba.com/taec/.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
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