Toshiba Rolls Out Wireless Power Receiver IC For Quick Charging Mobile Devices
August 17, 2015
Wireless charging of mobile devices now as fast as charging by cable
SAN JOSE, Calif., – Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced it has launched a new wireless power receiver IC that will enable mobile devices to be charged wirelessly as fast as if they were connected to the charger via a cable. The new TC7764WBG is compliant with Qi™ V.1.1.2, the wireless low power charging standard defined by the Wireless Power Consortium (WPC), which includes a dedicated specification for smartphones and mobile accessories.
Wireless charging allows adoption of a fully insulated case free of exposed charging ports, an advantage that is stimulating demand for waterproof and dustproof smartphones and other mobile devices. However, wireless charging has not always been as fast as charging by cable. Toshiba has addressed this problem by optimizing the circuit design of the TC7764WBG compared to its predecessor products, enabling maximum output power of 5W and maximum power conversion efficiency of 95 percent1. This will allow wireless charger makers utilizing the new IC to achieve performance as fast as that offered by cabled chargers, with added benefits.
"Once the de facto standard for charging mobile devices, cabled chargers will be gradually displaced by wireless power, which is a disruptive and effective technology for device charging today," said Deepak Mithani, senior director of the Mixed Signal Business Unit, System LSI Group at TAEC. “As we continue to expand and improve our offering of wireless power ICs, Toshiba is helping to drive broader consumer adoption and use of cable-free charging technology.”
To ensure mobile device safety, the new IC integrates a protocol authentication circuit for power transfers, foreign object detection functions, under-voltage lockout (UVLO) and over voltage detection (OVLO) functions, as well as thermal shutdown function (TSD). The IC is housed in a WCSP28 package measuring just 2.4mm by 3.67mm by 0.5mm.
Availability
The TC7764WBG wireless power receiver IC is available now.
*About TAEC
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
1The power conversion efficiency noted here only applies to TC7764WBG itself.
Qi is a trademark of the Wireless Power Consortium.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.