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Toshiba Debuts Compact Package MOSFETs for Controlling Power Sources, Data Signals in Mobile Devices

October 8, 2015

IRVINE, Calif., -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced the launch of two new compact MOSFETs - the SSM3K35CTC and SSM3J35CTC. Housed in a newly developed compact package (CST3C) the SSM3K35CTC and SSM3J35CTC are suitable for controlling power sources or data signals in mobile devices such as smart phones and wearables.

When it comes to the overall footprint, Toshiba’s CST3C package exceeds industry standards. In fact, the CST3C package is just one-third the size of the industry standard SOT-723 package. This makes Toshiba’s new MOSFETs suitable for high density mounting, and gives them the ability to achieve lower on-resistance when compared with products with a standard SOT-723 package.

Main Specifications: SSM3K35CTC, SSM3J35CTC (@Ta=25 °C)

Polarity

Part number

Package (Size)

Absolute maximum ratings

RDS (ON) typ. (Ω)

VDSS

(V)

ID

(A)

@|VGS|

=1.2 V

@|VGS|

=1.5 V

@|VGS|

=1.8 V

@|VGS|

=2.5 V

@|VGS|

=4.5 V

N-ch

SSM3K35MFV

SOT-723

(1.2×1.2 mm)

20 0.18 5 3 - 2 1.5 (@4V)

SSM3K35CT

SOT-883

(1.0×0.6 mm)

SSM3K35CTC*1

CST3C

(0.8×0.6 mm)

0.25 2.4 1.7 1.5 1.1 0.75
P-ch

SSM3J35MFV

SOT-723

(1.2×1.2 mm)

-20 -0.1 -20 -0.1 11 8.2 4.3 (@4V)

SSM3J35CT

SOT-883

(1.0×0.6 mm)

SSM3J35CTC*1

 

CST3C

(0.8×0.6 mm)

-0.25

3.2

2.3

2.0

1.5

1.1

*1: New product

Features of the SSM3K35CTC and SSM3J35CTC include:

  • New compact package CST3C (0.8×0.6 mm)
  • Controllable with a gate voltage of 1.2 V
  • Low drain-source on-resistance:
    SSM3K35CTC: RDS(ON)=2.4 Ω (typ.) @VGS=1.2 V
    SSM3J35CTC: RDS(ON)=3.2 Ω (typ.) @VGS= -1.2 V

Pricing and Availability

Toshiba’s new compact MOSFETs are available now. Please contact your local Toshiba Sales Office for samples.

About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.
 

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