November 23, 2015
Industry-first chip enables high-speed wireless transfer for power-hungry mobile devices
SAN JOSE, Calif., – Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today introduced the industry’s first1 single-chip wireless power receiver (RX) that can operate at 15 watts (W) and is compliant with Qi™ v1.2, the wireless charging standard. The TC7766WBG triples the received power capability of its predecessors2 with advanced design methodologies and the same ultra-compact package footprint. This enables wireless power for subsequent charging of smartphones, tablets and handheld devices at speeds comparable to or, in some cases, faster than conventional wired chargers.
The new 15W chip includes all the functions needed, including rectifier circuits and controllers, to construct a standalone wireless power transfer RX system. Toshiba’s original CD-0.13 process, based on 0.13-micron CMOS/DMOS semiconductor process technology, combines small packaging with high efficiency, facilitating system integration and allowing for a small-footprint, cost-optimized receiver system. The TC7766WBG is compatible with Toshiba’s TB6865AFG3 5W transmitter (TX) IC and its upcoming 15W TX IC4 that also complies with Qi v1.2.
“The ‘holy grail’ for wireless charging for high-performance portable devices has been 15W, and we’ve been steadily working toward this objective with continued additions to our family of wireless charging devices,” said Deepak Mithani, senior director of the Mixed Signal Business Unit, System LSI Group at TAEC. “Making a 15W wireless power chip that allows for rapid charging available to our customers in a package with the same footprint as our previous product will help speed the design-in process and help them get advanced charging devices to market more quickly.”
In addition to its 15W maximum output power, the TC7766WBG features maximum output current of 1.7 amps (A) and output voltage range of 5 volts (V) to 14V, full protections, and the new Qi Foreign Object Detection functions. It is housed in a low-Z-height WCSP28 package (2.4mm x 3.67mm x 0.5mm).
The chip is also compatible with the I2C interface. An optional receiver-side host controller can exchange information with a compatible transmitter and access the TC7766WBG’s operation status registers via I2C. This can allow, for example, notification of the wireless charging status via the display on the user’s mobile device and renegotiations of power delivery.
Samples of the TC7766WBG wireless power receiver IC will be available by the end of 2015, and mass production will begin in spring 2016.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm.
1Per Toshiba survey as of November 23, 2015
2TC7764WBG (5W receiver IC compliant with Q1 v1.1.2)
3Compliant with Q1 v1.1.2
5Serial interface developed by Philips Semiconductor (now NXP)
Qi is a trademark of the Wireless Power Consortium.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.