January 6, 2016
Qualcomm Snapdragon processors and modems to pair with Toshiba TC9560XBG Ethernet chipset
CONSUMER ELECTRONICS SHOW (CES), LAS VEGAS, – Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced it is working with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to bring to the automotive market advanced connected car platforms powered by Qualcomm® Snapdragon™ 820A and Snapdragon 602A processors, and telematics solutions powered by the Qualcomm Snapdragon X12 LTE modem.
Advanced sensors and cameras, high-resolution displays, automated driver assistance systems (ADAS) and other controls increasingly require levels of high-bandwidth connectivity not currently available on the market. Toshiba’s new automotive-grade TC9560XBG Ethernet bridge solution, announced today, supports the Ethernet-AVB standard – essential for multimedia applications. The product is designed to simplify wiring throughout the vehicle, optimizing in-vehicle infotainment (IVI) systems and other automotive applications, including telematics/LTE modem modules using Ethernet/Ethernet-AVB, while providing connectivity to CAN and CAN-FD engine control units simultaneously.
Connecting complex automotive electronics with an industry-standard Ethernet protocol also contributes to cost savings, reduced harness weight and improved mileage. In addition, the TC9560XBG will be AEC-Q100 qualified to enable enhanced performance in physically demanding automotive environments.
“Qualcomm’s Snapdragon 820AU and S602A processors and the X12 LTE Modem interface seamlessly with our new TC9560XBG IC,” noted Shardul Kazi, senior vice president, System LSI Group at TAEC. “The combination of capabilities embodied in these products will enable an exceptional level of connectivity and functionality in vehicles with next-generation infotainment systems.”
The cutting-edge Qualcomm Snapdragon 820A processor with X12 LTE Modem was developed to support the advanced connectivity, graphics, video, power, and battery efficiency needed for automotive solutions. The processor integrates a new custom 64-bit quad-core Qualcomm Kryo™ CPU, the Qualcomm Adreno™ 530 GPU, as well as the Qualcomm Hexagon™ 680 DSP with Hexagon Vector eXtensions. Qualcomm Technologies’ first generation automotive-grade infotainment processor, the Snapdragon 602A, was designed specifically to meet automotive industry standards and features the quad-core Qualcomm Krait™ CPU, Qualcomm Adreno 320 GPU, Qualcomm Hexagon DSP, integrated GNSS baseband processing and additional high-performance audio, video and communication cores. The Snapdragon X12 LTE Modem, Qualcomm Technologies’ premier modem within the Snapdragon family, supports next-generation features such as LTE-Advanced Carrier Aggregation, LTE in unlicensed spectrum (LTE-U), and LTE + Wi-Fi Link Aggregation, representing the ultimate in connectivity.
“Toshiba’s new Ethernet and CAN bridge chip is ideally suited as a companion to the capabilities of our Qualcomm Snapdragon processors and modems for infotainment and telematics applications,” said Nakul Duggal, vice president of product management, Qualcomm Technologies, Inc. “As Qualcomm continues to develop leading-edge automotive solutions, collaborating with Toshiba has been important as we expand into evolving automotive applications.”
The new Toshiba TC9560XBG Ethernet bridge solution and TC9560AXBG, with CAN-FD features, are available now, with volume production slated to begin in October 2016. The Qualcomm Snapdragon 820A processor utilizing Toshiba’s TC9560XBG IC is scheduled to go into production in the 2018 timeframe, with automotive samples available in Q1 2016. The Snapdragon 602A processor and X12 LTE modem are commercially available now.
Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.
Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor manufacturer and the world’s sixth largest semiconductor manufacturer (Gartner, 2014 Worldwide Semiconductor Revenue Estimates, December 2014). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 590 consolidated companies employing over 200,000 people worldwide. Visit Toshiba's web site at www.toshiba.co.jp/index.htm
Qualcomm, Snapdragon, Adreno and Hexagon, are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Krait and Kryo are trademarks of Qualcomm Incorporated. Snapdragon, Adreno, Hexagon, Krait and Kryo are products of Qualcomm Technologies, Inc. All Qualcomm Incorporated trademarks are used with permission. Other product and brand names may be trademarks or registered trademarks of their respective owners.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.