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Toshiba Launches Compact Bluetooth® Low Energy Communication IC for Scatternet Devices

February 23, 2016

Device housed in very thin chip-scale package supports communication for low-profile Bluetooth Smart applications

Toshiba TC35667WBG-006

SAN JOSE, Calif., – Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today launched the latest addition to its line of Bluetooth® Low Energy (BLE) communication ICs. The TC35667WBG-006 adopts Bluetooth Core Specification v4.1, enabling its use with scatternet1 devices, and is well suited for Bluetooth Smart2 applications including wearable sport and lifestyle products, remote controls, smartphone accessories, and devices for the Internet of Things (IoT).

The Bluetooth Core specification for version 4.0 and higher defines two standard scatternet functions. Adopted devices have to support either multiple or simultaneous connections with master and slave devices, or multiple connections between two or more master devices at the same time. Toshiba’s new IC supports both functions with BLE, simplifying creation of a network with very small devices.

“Growing connectivity and shrinking device thickness are hallmarks of many new Bluetooth Smart products that are coming to market,” said Deepak Mithani, senior director of the Mixed Signal Business Unit, System LSI Group at TAEC. “Toshiba’s newest BLE chip was developed to meet both of these requirements. In addition to being optimized for support of scatternet and multipoint connections, the IC comes in a small, thin chip-scale package, allowing designers to integrate this functionality without impacting the size and weight of their end products.”

The TC35667WBG-006’s combination of functionality and compact size – wafer chip-scale package (WCSP) dimensions are just 2.88mm x 3.04mm x 0.3mm high – makes it well suited to equip a BLE communication network in low-profile applications such as contactless cards, tags and tickets.

Compatible with voltages of 1.8V to 3.6V and temperatures of -40 to +85 degrees C, the new IC operates with current consumptions down to 5.9 milliamps and has a deep sleep mode that, when activated, reduces current consumption to just 0.5 microamp. On-board functionality includes DC/DC converter, low-dropout regulator, general-purpose ADC, and pulse-width modulation. User program function and a wake-up signal for a host device are also available.


Samples of the TC35667WBG-006 BLE chip have begun shipping.

*About TAEC

Through proven commitment, lasting relationships and advanced, reliable electronic components, Toshiba enables its customers to create market-leading designs. Toshiba is the heartbeat within product breakthroughs from OEMs, ODMs, CMs, VARs, distributors and fabless chip companies worldwide.  A committed electronic components leader, Toshiba designs and manufactures high-quality flash memory-based storage solutions, solid state drives (SSDs), hard disk drives (HDDs), solid state hybrid drives (SSHDs), discrete devices, custom SoCs/ASICs, imaging products, microcontrollers, wireless components, mobile peripheral devices, advanced materials and medical tubes that make possible today’s leading smartphones, tablets, cameras, medical devices, automotive electronics, industrial applications, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation, Japan’s largest semiconductor, solid state drive and hard disk drive manufacturer and the world’s seventh largest semiconductor manufacturer (Gartner, 2015 Worldwide Semiconductor Revenue, January, 2016). Founded in Tokyo in 1875, Toshiba is at the heart of a global network of over 580 consolidated companies employing over 199,000 people worldwide. Visit Toshiba's web site at

1A scatternet is a group of independent and non-synchronized piconets (a piconet is formed when at least two Bluetooth-enabled devices connect) that share at least one common Bluetooth device.
2Bluetooth Smart devices adopt Bluetooth Core Specification v4.0 or higher with a low-energy core configuration, and that use GATT-based architecture specified in Bluetooth v4.0.
Bluetooth, Bluetooth Low Energy and Bluetooth Smart Ready are registered trademarks owned by the Bluetooth SIG; Toshiba uses them under license.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

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