May 13, 2020
Small surface mounting contributes to low power consumption of automotive equipment
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched four new N-channel power MOSFETs of small surface-mount TSON Advance(WF) packages for automotive equipment. They are new in our lineup as low On-resistance N-channel MOSFET packed in TSON Advance(WF): 40 V “XPN3R804NC” and “XPN7R104NC,” 60 V “XPN6R706NC” and “XPN12006NC.”
The new products use TSON Advance(WF) packages with a wettable flank terminal structure, which facilitates automated visual inspection of board mounting conditions. In addition, the low On-resistance products using Toshiba’s "U-MOSVIII-H" process contribute to power saving of equipment. This enables us to replace Toshiba’s conventional products of the same size package. Performance improvements can also contribute to the downsizing of ECUs by replacing similar 5×6 mm sized products.
|Size typ. (mm)||3.3×3.6|
|Drain-source voltage VDSS (V)||40||40||60||60|
|Drain current (DC) ID (A)||40||20||40||20|
|Drain current (pulsed) IDP (A)||80||60||80||60|
|Channel temperature Tch (°C)||175|
Zth(ch-c) max (°C/W)
RDS(ON) max (mΩ)
Part numbers XPN7R104NC and XPN6R706NC are available now. Part numbers XPN3R804NC and XPN12006NC will be available in 3Q/CY20.
Toshiba America Electronic Components, Inc. (TAEC), an independent operating company owned by Toshiba America, Inc., is the US based electronic components business of Toshiba Electronic Devices and Storage Corporation. TAEC offers a wide variety of innovative hard disk drive (HDD) products and semiconductor solutions for data center, automotive, industrial, IoT, motion control, telecom, networking, consumer, and white goods applications. The company’s broad portfolio encompasses enterprise and consumer HDDs integrated wireless ICs, power semiconductors, microcontrollers, optical semiconductors.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.