Toshiba Launches Photorelays in New Package for High-density Mounting
September 14, 2020
TOKYO— Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched three photorelays, TLP3480, TLP3481 and TLP3482 in P-SON4, a new package with a significantly smaller mounting area than Toshiba’s SOP packages. Shipments start today.
All of the new photorelays have an OFF-state output terminal voltage rating and ON-state current rating comparable with products housed in SOP package products, with ratings ranging from 30V and 4.5A to 100V and 2A, according to the device.
The new P-SON4 package is highly suited to high-density mounting, as it has a mounting area of 7.2mm2 (typ.), approximately 74% smaller than the 2.54SOP4 package and 84% smaller than the 2.54SOP6 package. It also features low ON-resistance by using Toshiba’s latest MOSFET chips[1] in the receiver.
TLP3480, TLP3481, and TLP3482 have high ON-state-current ratings of 4.5A, 3A and 2A. They can be used in a wide range of measuring equipment applications.
Introduction of New Toshiba photorelay P-SON package
Applications
- Semiconductor testers (memory, SoC, LSI, etc.)
- Probe cards
- I/O interface boards
Features
- New small package P-SON4: 2.1 x 3.4mm (typ.), mounting area 7.2mm2 (typ.)
- Large ON-state current rating
TLP3480: OFF-state output terminal voltage rating: 30V, ON-state current rating: 4.5A
TLP3481: OFF-state output terminal voltage rating: 60V, ON-state current rating: 3A
TLP3482: OFF-state output terminal voltage rating: 100V, ON-state current rating: 2A
About Toshiba America Electronic Components, Inc.
Toshiba America Electronic Components, Inc. (TAEC), an independent operating company owned by Toshiba America, Inc., is the US based electronic components business of Toshiba Electronic Devices and Storage Corporation. TAEC offers a wide variety of innovative hard disk drive (HDD) products and semiconductor solutions for data center, automotive, industrial, IoT, motion control, telecom, networking, consumer, and white goods applications. The company’s broad portfolio encompasses enterprise and consumer HDDs integrated wireless ICs, power semiconductors, microcontrollers, optical semiconductors.
Notes:
1TLP3480, TLP3481, and TLP3482 are fabricated with the U-MOS process with trench-gate structures.
Follow the links below for more on the new products.
Follow the link below for more on Toshiba’s optical devices lineup.
Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.