President and CEO, Toshiba America Electronic Components, Inc.
Mr. Sano assumed the office of president and CEO for Toshiba America Electronic Components, Inc. (TAEC) in October 2015 and is a 29-year veteran in sales and marketing of Toshiba semiconductors. During his career, he has taken on a series of increasingly demanding assignments, including a previous six-year stint at TAEC as vice president responsible for sales and marketing of memories. This was a particularly important time in TAEC's history, when the company made the transition to NAND flash and away from the DRAM market. After returning to Japan, he held senior-level assignments including general manager of the Memory Division, responsible for global memory sales and marketing activities; senior manager responsible for promoting CMOS image sensors that are used in the majority of cameras in smartphones; and managing the SSD business as it grew from a niche product to a mainstream business with increasingly wide application. He holds a Bachelor of Laws degree and graduated from Kagoshima University.
Senior Vice President, Storage Products, Toshiba America Electronic Components, Inc.
Steve Fingerhut is senior vice president of the storage products business unit for Toshiba America Electronic Components Inc. (TAEC). Steve joined the company in March 2015 and manages Toshiba’s hard disk drive and solid state drive storage business across enterprise, data center and client segments. Steve comes to TAEC with a wide range of experience, having worked for San Disk Corporation, LSI Corporation and Intel Corporation in several senior positions. Prior to his tenure with these companies, Fingerhut obtained his MBA from Yale University, and led strategic projects for HP’s Business Critical Server group and Arthur Andersen’s Business Consulting practice.
Senior Vice President, System LSI Group, Toshiba America Electronic Components, Inc.
Mr. Kazi is senior vice president for the System LSI Group at Toshiba America Electronic Components, Inc. (TAEC). Mr. Kazi is responsible for System LSI Group's Business Units - Logic LSI, Mixed Signal and Imaging. His responsibility includes management of business units, engineering, finance, supply chain, strategic initiatives, human resources and other support functions for System LSI Group's operations as well as profit and loss performance. As a technology executive, he oversees the entire SLG engineering effort including Standard Products engineering, SoC Design Centers, and the Design Solution Groups. Formerly he was the vice president of the Application Specific Standard Products (ASSP) Business Unit for TAEC and prior to that he was chief operating officer and vice president at ArTile Microsystems, Inc., a TAEC spin-off. Prior to TAEC, he has held several senior management level positions at companies such
Senior Vice President, Memory Marketing, Toshiba America Electronic Components, Inc.
As the senior vice president of memory marketing, Scott Nelson is responsible for the sales and marketing of TAEC's North American memory product line, which includes MLC and SLC NAND Flash-based storage solutions. Under his direction, these products are targeted for use in three major market segments, including removable data storage in digital consumer applications, embedded NAND solutions, and mobile electronics for OEM customers. Mr. Nelson joined TAEC in 1986, and he has held numerous sales, marketing and product management positions since that time within the company's memory business unit, leading up to his current position. Nelson holds a Bachelor of Arts degree in business and operations management from California State University at Fullerton, and an MBA from Pepperdine University.
Vice President, Discrete Business Unit, Toshiba America Electronic Components, Inc.
Jay Heinecke is vice president of business development for the Discrete Business Unit of TAEC, with sales and marketing responsibilities for TAEC's North American discrete product line, which includes: power semiconductors, optoelectronics, microwave and RF devices, logic and small signal devices. His responsibilities also include sales and marketing functions for TAEC’s advanced materials, amorphous cores, and electron tubes product groups. Toshiba is a leading discrete semiconductor supplier worldwide, and the company's devices are designed to meet the growing demand for high-performance and lower voltages in today's wireless telecommunications and consumer electronics applications, as well as the requirements of the automotive and industrial markets. Mr. Heinecke joined TAEC in 1988, and has held various sales, marketing, operational, and product management positions during that time up to his current position. He holds a Bachelor of Arts degree in marketing from the University of Wisconsin, and an MBA from Lake Forest Graduate School, in Lake Forest, Illinois.