August 31, 2023
Toshiba Electronic Devices & Storage Corporation
KAWASAKI, Japan—Toshiba Electronic Devices & Storage Corporation (Toshiba) has launched silicon carbide (SiC) MOSFETs, the "TWxxxZxxxC series,” that use a four-pin TO-247-4L(X) package that reduces switching loss with the company’s latest 3rd generation SiC MOSFETs chip for industrial equipment. Volume shipments of ten products, five with 650V ratings and five with 1200V, start today.
The new products are the first in Toshiba’s SiC MOSFET line-up to use the four-pin TO-247-4L(X) package, which allows Kelvin connection of the signal source terminal for the gate drive. The package can reduce the effect of source wire inductance inside the package, improving high-speed switching performance. For the new TW045Z120C, the turn-on loss is approximately 40% lower and the turn-off loss reduced by approximately 34%, compared with Toshiba’s current product TW045N120C in a three-pin TO-247 package. This helps to reduce equipment power loss.
A reference design for a Three-phase inverter using SiC MOSFETs is published online.
Toshiba will continue to expand its line-up to meet market trends and contribute to improving equipment efficiency and enlarging power capacity.
 As of August 2023.
 As of August 2023, values measured by Toshiba (test condition: VDD=800V, VGG=+18V/0V, ID=20A, RG=4.7Ω, L=100μH, Ta=25°C)
(Ta=25°C unless otherwise specified)
|Part number||Package||Absolute maximum ratings||Electrical characteristics||Sample Check & Availability|
|Drain-source voltage VDSS (V)||Gate-source voltage VGSS (V)||Drain current (DC)
|Drain-source On-resistance RDS(ON) (mΩ)||Gate threshold voltage Vth (V)||Total gate charge Qg (nC)||Gate-drain charge Qgd (nC)||Input capacitance
|Diode forward voltage VDSF (V)|
|Tc=25°C||VGS=18V||VDS=10V||VGS=18V||VGS=18V||typ.||Test condition VDS (V)||VGS=-5V|
|1200||-10 to 25||100||15||3.0 to 5.0||158||23||6000||800||-1.35|
Power Device Sales & Marketing Dept.
* Company names, product names, and service names may be trademarks of their respective companies.
* Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.