Power supply applications require power MOSFETs with high efficiency, small size and high reliability. Since the release of its first power MOSFET, Toshiba’s power MOSFETs have been widely used in various markets.
In response to the market demand, Toshiba has developed the new high-voltage DTMOS series, the low-voltage U-MOS series, and MOSFETs fabricated using a new material called silicon carbide 「SiC」 contributing to the energy-saving of power supplies.
Name | Outline | Date of issue | |
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Describes the features of the new package and an operation analysis using simulation | 9/2017 | coming soon |
Describes the features of the DTMOSV series and the improvements from the previous series | 9/2017 | ||
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Describes the mechanism of noise generation and noise reduction techniques | 9/2017 | coming soon |
Name | outline | Date of issue | |
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Describes planar, trench and super-junction power MOSFETs | 11/2016 | ||
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Describes the absolute maximum ratings, thermal impedance and safe operating area of power MOSFETs | 11/2016 | |
Describes electrical characteristics shown in datasheets | 11/2016 | ||
Describes how to select power MOSFETs, temperature characteristics, the impacts of wires and parasitic oscillation, avalanche ruggedness, snubber circuits and so on | 11/2016 | ||
Describes thermal equivalent circuits, examples of channel temperature calculation and considerations for heatsink attachment | 2/2017 | ||
Describes the guidelines for the design of a gate driver circuit for MOSFET switching applications and presents examples of gate driver circuits | 8/2017 | ||
Describes current imbalance in parallel MOSFETs and the mechanism of parasitic oscillation | 8/2017 | ||
Describes the oscillation mechanism of MOSFETs for switching applications | 8/2017 |
Name | outline | Date of issue |
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Describes the lineups of MOSFET | 9/2017 |
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Describes the lineups of power and small-signal MOSFETs by package | 3/2016 |
Name | Outline | Date of issue |
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Describes an overview of the power supply, design reference documents, electronic files that can be imported into EDA tools, and an overview of the constituent devices | 10/2017 |
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