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Serial Interface NAND

Related Information

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Features of Serial Interface NAND

Control interface consisting of a low pin count

Supports Mode 0 and Mode 3 of Serial Peripheral Interface (SPI)

Incorporates ECC logic

Eliminates the need for a host processor to perform ECC and is configurable to provide ECC correction information necessary for memory management

Fabricated using a 24-nm process, the most advanced technology node for SLC NAND

Latest 24-nm SLC NAND process

Wide range of capacity points

Available in production quantities with 1-Gbit, 2-Gbit and 4-Gbit capacity points

Available in small packages

6 x 8mm WSON, 10.3 x 7.5mm SOP, 6 x 8mm BGA(*)

*BGA package is under planning

Serial Interface NAND Block Diagram
* The ECC logic in Serial Interface NAND can be enabled and disabled by the customers.

Product Lineup

Category Density
Serial Interface NAND 1 Gb 2 Gb 4 Gb

*Please click on any item to show detailed product line up and to download datasheet.


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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.