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MOSFET Product lineup

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Packaging for Low on-resistance

By mounting a Cu connector with a lower resistance value than aluminum or other bonding wire, low on-resistance characteristics and large current correspondence are realized. Products with on-resistance standard value less than 1 mΩ are deployed.

Cu Connector Structure

mounting area

On-resistance example of Packages with Cu Connector structure
Package RDS(ON) (Max) Lineups
DPAK type 1.35mΩ@10V (DPAK+) Lineups
SOP type 0.79mΩ@10V (SOP Advance) Lineups
TSON type 4.1mΩ@10V (TSON Advance) Lineups
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·Before creating and producing designs and using, customers must also refer to and comply with the latest versions of all relevant TOSHIBA information and the instructions for the application that Product will be used with or for.