News Center

This page is listing links of the press release and topics published by Toshiba Electronic Devices and Storage Corporation.
Information in the news and topics, including product prices and specifications, content of services and contact information, is current on the date of the news announcement, but is subject to change without prior notice. The news before March 31, 2017 is the news published by Toshiba Storage & Electronic Devices Solutions Company.

Release Year
Category
News Category
21-11-2019
Amendment to Tender Offer Registration Statement (Tender Offeror: Toshiba Electronic Devices & Storage Corporation, Target Company: NUFLARE TECHNOLOGY, INC.)
21-11-2019
Tender Offer Registration Statement (Tender Offeror: Toshiba Electronic Devices & Storage Corporation, Target Company: NUFLARE TECHNOLOGY, INC.)
20-11-2019
東芝推出首款可重複使用電子熔斷器 - eFuse IC
13-11-2019
Strategies about Logic LSI (advanced ASIC) business
13-11-2019
Notice Regarding Commencement of Tender Offer for Shares of NuFlare Technology, Inc. (Code: 6256)
29-10-2019
東芝新推出採用智慧相位控制及閉環速度控制技術之三相無刷馬達控制預驅動IC
17-10-2019
東芝推出適用於ThunderboltTM 3及其他高速訊號線的低電容TVS Diode
30-09-2019
Toshiba Launches 600V Sine-Wave PWM Driver IC for Three-Phase Brushless Motors
26-09-2019
Toshiba Launches High-voltage Dual-channel Solenoid Driver IC
25-09-2019
Toshiba Launches Voltage Driven Photorelay in Industry’s Smallest Package with Reduced Input Power Dissipation
03-09-2019
Toshiba Adds 16TB Capacity to N300 and X300 Internal Hard Drive Series
03-09-2019
Low capacitance TVS diodes for automotive applications offering fine protection performance while keeping signal quality at several Gbps : DF2S5M4FS, DF2S6M4FS
20-08-2019
A lineup expansion of TVS diodes for mobile devices by a product with an increased peak pulse current rating for improved surge protection performance: DF2B7BSL
19-07-2019
Launch of photocouplers for IGBTs and MOSFETs gate drive that are thin, support high temperature operations, and can be mounted on the back side of a board or where height is limited: TLP5751H(LF4), TLP5752H(LF4), TLP5754H(LF4)
10-07-2019
Toshiba expands lineup of SBD, which uses a compact package with high heat dissipation ability that allows easier thermal design, by 30 V/ 40 V products: CUHS20F40, CUHS20F30, CUHS15F40, CUHS15F30, CUHS20S40, CUHS20S30, CUHS15S40, CUHS15S30
21-06-2019
-40 V P-channel power MOSFETs for automotive use, with -4.5 V drive voltage enabling operation even during a battery voltage drop: XPH3R114MC, XPH4R714MC, XPN9R614MC
14-06-2019
Toshiba’s IGBT/IEGT Compact Modeling Realizes Highly Accurate Prediction of Power Efficiency and EMI Noise
11-06-2019
搭載東芝高階影像識別處理器的豐田Alphard/Vellfire車款，榮獲日本最高預防安全性能獎賞
11-06-2019
Toshiba Launches New Family of Low Voltage Driven Photorelays --Photorelays in tiny packages enable high-density assembly in test equipment applications--
30-05-2019
Toshiba Launches Low Power Consumption Brushed DC Motor Driver IC with Popular Pin-assignment HSOP8 Package
開啟新視窗