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Automotive Peripheral Bridge ICs
SoCs, widely applied in smartphones and tablets, are increasinly appearing in automotive applications as IVI systems become more sophisticated, requiring greater functionality and higher performance. But because connectivity standards differ among devices such as displays, existing SoCs often lack the interfaces required for automotive networks.
Lineup
| Camera | HDMI® | Display | Display | |||
|---|---|---|---|---|---|---|
| Automotive |
TC9591XBG | TC9590XBG | TC9592XBG |
TC9593XBG | TC9594XBG | TC9595XBG |
| Consumer |
TC358748I | TC358743I | TC358774 | TC358775 | TC358778 | TC358867 |
| Input | MIPI CSI2 RX 4Lanes x 1ch Parallel input 24bit@154MHz |
HDMI® 1.4a | MIPI DSI 4 Lanes x 1ch |
MIPI DSI 4 Lanes x 1ch |
Parallel input 24bit@154MHz |
MIPI DSI 4 Lanes x 1ch. / MIPI DPI (24bit) |
| Output | Parallel output 24bit@100MHz MIPI CSI2-TX |
MIPI CSI2-TX 4Data LanesX1ch |
LVDS Single Link (5 pairs/ link) |
LVDS Dual Link (5 pairs/ link) |
MIPI DSI-TX 4Lanes x 1ch |
Display Port 1.1a x 2 Ports MIPI DPI (24bit) |
| Resolution | - | - | UXGA 1600x1200 @24bit |
WUXGA 1920x1200 @24bit |
WUXGA 1920x1200 @24bit |
WUXGA 1920x1200 @24bit |
| Ta | -40 ～ 105℃ | -40 ～85℃ | -40 ～ 85℃ |
-40 ～ 85℃ | -40 ～ 105℃ | -40 ～ 85℃ |
| PKG | VFBGA80 7mm x 7mm 0.65mm pitch |
LFBGA64 7mm x 7mm 0.8mm pitch |
VFBGA49 5mm x 5mm 0.65mm pitch |
VFBGA64 6mm x 6mm 0.65mm pitch |
VFBGA80 7mm x 7mm 0.65mm pitch |
VFBGA80 7mm x 7mm 0.65mm pitch |
Recommended product
Automotive Peripheral Bridge IC TC9594XBG
Automotive Peripheral Bridge IC for In-Vehicle Infotainment (IVI) systems – Parallel to MIPI DSI℠
Automotive Peripheral Bridge IC TC9595XBG
Automotive Peripheral Bridge IC for In-Vehicle Infotainment (IVI) systems - MIPI DSI / DPI℠ to DisplayPort™
Technical topics
System Block Diagram
Necessity of AMPD (Interface Bridge IC)
SoC with only MIPI I/Fs as AV I/F may require AMPDs to connect external devices such as displays and cameras.
Toshiba’s new range of video interface bridge devices provide HDMI® to MIPI® CSI-2 (TC9590), MIPI® CSI-2 to/from parallel (TC9591), and MIPI® DSI to LVDS (TC9592/3) connectivity. The devices are offered in 0.65mm pitch, VFBGA packages between 5 x 5 mm and 7 x 7mm, with the exception of the TC9590 which is housed in an LFBGA64, 0.8mm pitch 7 x 7mm package.
Toshiba has a long track record of developing MIPI® -based interface bridge chips for consumer applications and has drawn on this experience in developing the new automotive IVI range.
Sample shipments of the new devices start in June 2018.
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* The terms HDMI, and HDMI High-Definition Multimedia Interface, and the HDMI Logo are trademarks or registered trademarks of HDMI Licensing Administrator, Inc. in the United States and other countries.
* MIPI® is registered service marks of MIPI Alliance, Inc.
* Other company names, product names, and service names may be trademarks of their respective companies.
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