ICs de equipamento de comunicações sem fio
Uma nova janela será aberta
To address the needs of the rapidly growing market for proximity wireless applications, Toshiba has developed an ultra-small TransferJet™ SDIO module. The smallest possible components are required for space-critical mobile devices such as smartphones. The ultra-small TransferJet™ SDIO module, which embodies Toshiba's radio-frequency (RF) design and hybrid integration technologies, helps save board space. The TJM35420XLQ module contains RF components and a crystal oscillator to simplify the design of TransferJet™ applications.