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Toshiba announces Bluetooth® 5 IC for Automotive Applications

 October 30, 2018 

Highly expandable and integrated device will be fully AEC-Q100 qualified

Toshiba TC35681IFTG

IRVINE, Calif. – Toshiba America Electronic Components Inc.  (Toshiba) has announced a new Bluetooth® Low Energy (LE) IC for automotive applications will be added to their IC line-up. The TC35681IFTG is based on an arm® Cortex®-M0 CPU and is compliant with Bluetooth® core specification 5.0. It will be used in various automotive applications including Remote Keyless Entry (RKE), On-Board Diagnostics (OBD) and Tire Pressure Monitoring Systems (TPMS), all of which improve comfort and safety.

The mixed-signal TC35681IFTG contains both analog RF and baseband digital parts to provide a complete solution in a single QFN40 ‘wettable flank’ package measuring just 6.0 mm x 6.0 mm. Designed for compliance with AEC-Q100, the low energy IC is primarily intended to be used in automotive applications. The wettable flank package simplifies automatic visual inspection needed to ensure delivery of the high levels of soldering quality required to help withstand vibration experienced in automotive applications.

Alongside basic functions such as Host Controller Interface (HCI) profile and GATT profile, new functions as defined by Bluetooth® core specification 5.0 are provided including 2Mbps data rates, long range and advertising extension functions, all of which are stored in the internal mask ROM. In addition, the TC35681IFTG integrates a high gain power amplifier and realizes +8dBm for long distance communication.

It is suitable for use in harsh automotive environments due to the wide operating temperature range of -40°C to +125°C as well as its high RF transmission power and excellent RF reception sensitivity (the link budget is 113dB @125kbps in long range operation). The device operates from a single 1.8V to 3.6V supply, drawing just 50 nA in deep sleep mode. An on-chip DC-DC converter adjusts the external voltage supply to the required values. When transmitting, the current draw is only 11.0mA and this reduces to 5.1mA when receiving.

The new IC becomes a fully-fledged application processor when used in conjunction with an external non-volatile memory by loading application programs and storing data temporarily to the internal RAM (76KB). It can also be used in combination with an external host processor.

The TC35681IFTG is able to form an integral part of sophisticated systems due to its 18 General Purpose IO (GPIO) lines and multiple communications options including SPI, I2C and a 921.6kbps, two-channel UART. The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface and a 5-channel A/D converter.

Follow the link below for more information on the new product:-

For more information about the line-up of Bluetooth® wireless communication ICs, please visit:

Part Number


Operating voltage range

1.8V to 3.6V

Current consumption in TX operation

11.0 mA (@3.0 V, Output Power : 8 dBm, 1 Mbps mode )

Current consumption in RX operation

5.1 mA (@3.0V, 1Mbps mode)

Current consumption in deep sleep

50nA (@3.0V)

Operating temperature range

-40°C to 125 °C


QFN40 6 mm x 6 mm 0.5 mm pitch, wettable flank

Wireless Communication

Bluetooth® Low Energy Ver.5.0


ARM® Cortex®-M0

Transmitter output power

8 dBm to -20 dBm (8,7,6,4,0,-6,-20 dB)

Receiver sensitivity

-95.6 dBm (1 Mbps mode)


HCI, GATT (Generic Attribute Profile), including server and client functions



Other features

Compliant with AEC-Q1003

Central and peripheral functions

DC-DC Converter

Low drop regulator

General purpose ADC

User program function

Wake up signal for host device

PWM function

3Qualification expected by spring of 2019.
*The Bluetooth® word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc. and any use of such marks by Toshiba is under license. Other trademarks and trade names are those of their respective owners.
*arm and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the US and/or elsewhere.
* Other company names, product names, and service names mentioned herein may be trademarks of their 


Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.

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