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About information presented in this cross reference

The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Please explain permissible power dissipation.

The permissible power dissipation of an unmounted IC is rated without any heat sink or any heat dissipation path through a printed circuit board. Without heat dissipation, an application of a large electric current causes an IC to heat up, leading to thermal shutdown (TSD) of the IC. If the IC is left in this condition, its temperature exceeds the absolute maximum temperature, increasing the likelihood that it will be permanently damaged.
Therefore, consult application notes for each device and create a thermal design that allows sufficient temperature margin so that the junction temperature will not exceed 150°C. In addition, keep in mind that an increase in ambient temperature reduces the permissible power dissipation.

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