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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.

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Contributing to reduction of mounting space by adoption of a thin package

Our isolation amplifier contributes to the reduction of mounting space by adopting a new thin package.

Adoption of a new SO8L thin package

Package side view TLP7820 vs. competitor item

The figure below shows a side view of packages of the TLP7820/7830 and other products. The TLP7820/7830's new 2.3-mm-height, thin-package SO8L has enabled it to be thinner than its competitors' conventional products, thereby reducing mounting space.

SO8L Package + Mounting on back side of PCB


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