Excellence in Power

Across automotive, AI and data centre infrastructure, renewable energy, industrial automation, and grid applications, engineers face increasing demands for efficiency, power density, thermal performance, and reliability.

Toshiba's Excellence in Power portfolio combines advanced silicon MOSFET, SiC MOSFET and power semiconductor technologies, innovative packaging solutions, and manufacturing expertise to support efficient power conversion, reduced losses, improved thermal management, and long-term system reliability.

From automotive electrification to industrial, energy and AI /Data Centre infrastructure, Toshiba helps engineers optimise performance, efficiency, and sustainability in next-generation power electronic systems.

We look forward to supporting your next design.

Your Toshiba Power Semiconductor Team

Power Semiconductor Portfolio News

Power Semiconductor Overview

Technology Demonstrations and Product Previews

Image of a reference board. In the background your see a train

Gate Drive Circuit Solution for SiC MOSFET Module

The solution offers a built-in implementation of a SiC MOSFET Module. It provides an independent open-collector fault signal output of high-side and low-side. The output voltage is +20V (typ.) / -6.7V (typ.), the output current ±9.8A (max.) and the max. PWM frequency 50kHz.

TLP5231 – isolated pre-gate driver    SSM6K804R – n-ch MOSFET  

TPC8132 – p-ch MOSFET   TCR1HF50B – LDO Regulator

SSM3K15AFS – n-ch MOSFET  2SC6026MFV – npn transistor

 

 

Image of single channel H-Bridge driver with integrated current monitoring

Single channel H-Bridge driver with integrated current monitoring

The H-Bridge drivers TB67H453FNG/FTG provide an extended operating voltage range, max ratings and a built-In logic regulator for ultra-low standby current. As a benefit no external capacitor is needed. Target applications are robot vacuum cleaners, home and office applications, industrial equipment and many more.

TB67H453FNG   TB67H453FTG

 

 

Automotive Thermal Management

Toshiba's SmartMCDTM enables space and system cost savings in automotive applications. The device features an integrated microcontroller with a gate driver to create an effective solution for automotive pump,  fans and more. 

TB9M003FG       

SmartMCD Flyer

More Demos

Picture show press pack and circuit schematics

Press Pack IEGT (PPI)

Applications

  • Motor drives, Transmission & Distribution, Power quality

Highlights

  • Pressure contact with improved thermal fatigue
  • Low thermal impedance due to double side cooling
  • Moisture & weather resistant due to hermetic sealing
  • Electrically shorted in failure for proper system operation

Featured products

 

 

 

Picture show Sic Module inverters

SiC Module Inverter

Applications

  • Rail traction and Motor drive

Highlights

  • High efficiency by SiC modules
  • Compact design
  • 2-153A1A  package:  High mounting compatibility to Si IGBT module / Lower loss characteristics than Si IGBT module / Low stray inductance
  • RD237 - Gate Driver Solution for 1200V and 1700V SiC MOSFET Modules

Featured products

                1200V – 600A/400A SiC module in 2-153A1A  package

                1700V – 400A/250A SiC module in 2-153A1A  package

  • RD237 - Gate Driver Solution for 1200V and 1700V SiC MOSFET Modules

SiC Cube – Modular Multi-Level 3-Phase PFC

Applications

  • Power factor correction & AC/DC conversion

Highlights

  • High efficiency by SiC MOSFET
  • Multi-level, modular design

Featured products

  • TW045N120C – 3rd Generation SiC MOSFET
  •             Good reliability because of built-in SBD
  •             Fast switching because of low RDS(ON)*Qgd
  •             Wide VGSS rating
  • TLP5214A – Smart Gate-Driver
  •             High peak output current
  •             Wide power supply voltage range
  • TLP7820 – Isolation Amplifier
  •             High gain accurracy and bandwidth
  • TMPM4KNFYAFG – MCU
  •             160MHz Arm® Cortex®-M4 with Vector Engine

 

Picture shows a train with a iXPLV package and a 2-153A1A package added to it.

High Power SiC Modules

Applications

  • Rail traction and Motor drive

Highlights

  • iXPLV package (intelligent fleXible Package Low Voltage)
  •                 High reliability by using silver sintering technology
  •                 High channel temperature(Tj,max = 175°C)
  •                 Low stray inductance
  • 2-153A1A  package
  •                 High mounting compatibility to Si IGBT module
  •                 Lower loss characteristics than Si IGBT module
  •                 Low stray inductance

Featured products

  • MG600Q2YMS3        - 1200V / 600A /Package: 2-153A1A
  • MG400Q2YMS3        - 1200V /400A /Package: 2-153A1A
  • MG400V2YMS3        - 1700V / 400A /Package: 2-153A1A
  • MG250V2YMS3        - 1700V / 250A /Package: 2-153A1A
  • MG250YD2YMS        - 2200V / 250A /Package: 2-153A1A
  • MG800FXF2YMS3    - 3300V / 800A /Package: iXPLV
Picture shows a demo of a power tool.

Power Tool Demo

Applications

  • Power Tools
  • Gardening Tools

Highlights

  • Very compact design
  • Flexibility by interchangeable Control MCU and 
  • Power Stage Boards for 12-48V battery voltages

Featured products

  • Microcontroller specialized for Motor Control
  •             Recommended usage of TXZ+™4A Series, M4K Group
  •             Arm® Cortex®-M4 with Vector Engine*
                significantly improves system performance
  • TB67Z833SFTG – Programable Gate-Driver for 3-Phase motor
  •             Serial SPI Interface to control and diagonstics
  •             Optional integrated current sense amplifier
  • MOSFETs
  •             TPH1R204PB: 40V, 1.2mΩ, low-spike, 240A
  •             TPH2R408QM: 80V, 2.43mΩ, low-spike, 120A

*1 Vector Engine is an accelerator for field oriented control mathematical operation

Picture shows a demo of a fan, plus block diagram.

Fan Thermal Management, using SmartMCD™ 

Applications

  • Fan for thermal management in eMobility applications
  • Water pump

Highlights

  • Integrated solution for MCU and pre-driver
  • Flexibility by using different external MOSFETs

Featured products

  • TB9M003FG – SmartMCD™ for BLDC motors
  •             Cortex-M0, plus Vector Engine*
  •             Integrated gate driver
  • Automotive Power MOSFETs
  •             TPHR7904PB (40V, 0.79mOhm, 5x6mm²)
  •             XPN3R804NC (40V, 3.8mOhm, 3.3x3.6mm²)
  •             XSM6K519NW (40V, ~17mOhm, 2x2mm²)
  •             SSM6K809R, U-MOSⅧ-H, 2.9×2.8mm²

*1 Vector Engine is an accelerator for field oriented control mathematical operation

Company introduction

Technology Research & Development Papers

Improved reliability of a 2200 V SiC MOSFET module with an epoxy-encapsulated insulated metal substrate

H. Kono et al., "Improved reliability of a 2200 V SiC MOSFET module with an epoxy-encapsulated insulated metal substrate", 04/2024 Power Conversion and Intelligent Motion (PCIM) Europe, Nürnberg, Germany, 2024, pp. 2017-2022. Doi: 10.30420/566262283

© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10654147)

 

Improving the Short-Circuit Capability of RC-IEGT by Backside Double P-ring Structure

R. Gejo et al., "Improving the Short-Circuit Capability of RC-IEGT by Backside Double P-Ring Structure", 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Bremen, Germany, 2024, pp. 25-28. Doi: 10.1109/ISPSD59661.2024.10579684

© © 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10579684)

 

Paralleling 3.3-kV/800-A rated SiC-MOSFET Modules: An Optimization Method

H. Irifune et al., "Paralleling 3.3-kV/800-A rated SiC-MOSFET Modules: An Optimization Method", 042024 Power Conversion and Intelligent Motion (PCIM) Europe, Nürnberg, Germany, 2024, pp. 2023-2030. Doi: 10.30420/566262284

© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10654094)

 

Demonstration of Pseudo Independent Driving of Buried Gate in Trench Field Plate MOSFETs

T. Nishiwaki et al., "Demonstration of Pseudo Independent Driving of Buried Gate in Trench Field Plate MOSFETs", 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Bremen, Germany, 2024, pp. 355-358. Doi: 10.1109/ISPSD59661.2024.10579695

© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10579695)

 

Technical Demo and Solution Videos

SmartMCD

Servo Drive Reference Model

Automated Guided Vehicle (AGV)

Time Sensitive Network

Motor Control Knowledge Hub: Journey of Motor Control

Empowering Motion

Explore motor control technologies for industrial and automotive applications, including microcontrollers, motor driver ICs, development tools, reference materials, technical videos and design insights. Learn how brushed, brushless and stepper motor solutions can improve efficiency, precision and reliability in modern systems. Toshiba has over 40 years of core competence delivering high quality, reliable motor control MCDs and MCUs to meet customer's needs, enhance energy efficiency,  make power driven applications more smoothly and support a more sustainable future.

Innovation & Insights into Power Semiconductors

Whitepapers, HV Lab, Articles & Podcasts

electronicnet.de: Interview

Armin Derpmanns, Vice President Marketing & Operations at Toshiba Electronics Europe, spoke with Iris Stroh from Markt&Technik, a renowned electronics publication in Germany. (*Interview in German language. Copyright: Markt & Technik, electronicnet.de)

 

The Electropages Podcast 

Host Robin Mitchell  and Armin Derpmanns, Vice President of Marketing and Operations at Toshiba discuss the growing role of silicon carbide, and Toshiba's strategic move towards sustainability and digitalization.

Whitepapers

Find detailed information about the benefits of our MOSFET-portfolio including SiC, HV- and LV-MOSFETs at our innovation centre.

High Voltage Laboratory

Toshiba's high voltage laboratory in EMEA allows us to address  application-related questions from customers more rapidly.

Power Focus Interview

Learn more about TEE’s focus on power in our interview* with the magazine Markt & Technik. *Please note that the interview is in German..

Engineering FAQs on Toshiba's portfolio

Frequently viewed FAQ
What is a photocoupler?
Isolators/Solid State Relays Common
What types of photocouplers are available?
Isolators/Solid State Relays Common
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