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Gate Drive Circuit Solution for SiC MOSFET Module
The solution offers a built-in implementation of a SiC MOSFET Module. It provides an independent open-collector fault signal output of high-side and low-side. The output voltage is +20V (typ.) / -6.7V (typ.), the output current ±9.8A (max.) and the max. PWM frequency 50kHz.
TLP5231 – isolated pre-gate driver SSM6K804R – n-ch MOSFET
TPC8132 – p-ch MOSFET TCR1HF50B – LDO Regulator
SSM3K15AFS – n-ch MOSFET 2SC6026MFV – npn transistor
Single channel H-Bridge driver with integrated current monitoring
The H-Bridge drivers TB67H453FNG/FTG provide an extended operating voltage range, max ratings and a built-In logic regulator for ultra-low standby current. As a benefit no external capacitor is needed. Target applications are robot vacuum cleaners, home and office applications, industrial equipment and many more.
Automotive Thermal Management
Toshiba's SmartMCDTM enables space and system cost savings in automotive applications. The device features an integrated microcontroller with a gate driver to create an effective solution for automotive pump, fans and more.
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1200V – 600A/400A SiC module in 2-153A1A package
1700V – 400A/250A SiC module in 2-153A1A package
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Applications
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Applications
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*1 Vector Engine is an accelerator for field oriented control mathematical operation
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*1 Vector Engine is an accelerator for field oriented control mathematical operation
H. Kono et al., "Improved reliability of a 2200 V SiC MOSFET module with an epoxy-encapsulated insulated metal substrate", 04/2024 Power Conversion and Intelligent Motion (PCIM) Europe, Nürnberg, Germany, 2024, pp. 2017-2022. Doi: 10.30420/566262283
© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10654147)
Improving the Short-Circuit Capability of RC-IEGT by Backside Double P-ring Structure
R. Gejo et al., "Improving the Short-Circuit Capability of RC-IEGT by Backside Double P-Ring Structure", 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Bremen, Germany, 2024, pp. 25-28. Doi: 10.1109/ISPSD59661.2024.10579684
© © 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10579684)
Paralleling 3.3-kV/800-A rated SiC-MOSFET Modules: An Optimization Method
H. Irifune et al., "Paralleling 3.3-kV/800-A rated SiC-MOSFET Modules: An Optimization Method", 042024 Power Conversion and Intelligent Motion (PCIM) Europe, Nürnberg, Germany, 2024, pp. 2023-2030. Doi: 10.30420/566262284
© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10654094)
Demonstration of Pseudo Independent Driving of Buried Gate in Trench Field Plate MOSFETs
T. Nishiwaki et al., "Demonstration of Pseudo Independent Driving of Buried Gate in Trench Field Plate MOSFETs", 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD), Bremen, Germany, 2024, pp. 355-358. Doi: 10.1109/ISPSD59661.2024.10579695
© 2024 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. And published article is uploaded in IEEE Xplore (https://ieeexplore.ieee.org/document/10579695)
Watch our demo videos for
SmartMCD
Servo Drive Reference Model
Automated Guided Vehicle (AGV)
Time Sensitive Network
Empowering Motion
Toshiba has over 40 years of core competence delivering high quality, reliable motor control MCDs and MCUs to meet customer's needs, enhance energy efficiency, make power driven applications more smoothly and support a more sustainable future.
Armin Derpmanns, Vice President Marketing & Operations at Toshiba Electronics Europe, spoke with Iris Stroh from Markt&Technik, a renowned electronics publication in Germany. (*Interview in German language. Copyright: Markt & Technik, electronicnet.de)
Host Robin Mitchell and Armin Derpmanns, Vice President of Marketing and Operations at Toshiba discuss the growing role of silicon carbide, and Toshiba's strategic move towards sustainability and digitalization.
Find detailed information about the benefits of our MOSFET-portfolio including SiC, HV- and LV-MOSFETs at our innovation centre.
Toshiba's high voltage laboratory in EMEA allows us to address application-related questions from customers more rapidly.
Learn more about TEE’s focus on power in our interview* with the magazine Markt & Technik. *Please note that the interview is in German..
In the podcast Passion for technology the need for miniaturisation of analog devices is discussed.