Contributing to reduction of mounting space by adoption of a thin package

Our isolation amplifier contributes to the reduction of mounting space by adopting a new thin package.

Adoption of a new SO8L thin package

Package side view TLP7820 vs. competitor item

The figure below shows a side view of packages of the TLP7820/7830 and other products. The TLP7820/7830's new 2.3-mm-height, thin-package SO8L has enabled it to be thinner than its competitors' conventional products, thereby reducing mounting space.

SO8L Package + Mounting on back side of PCB

Related information


Technical inquiry

Contact us

Contact us

Frequently Asked Questions


Queries about purchasing, sampling and IC reliability

Stock Check & Purchase


Disclaimer for External Link
Through this website you are able to proceed to the website of our distributors ("Third Party Website") which is not under the control of Toshiba Corporation and its subsidiaries and affiliates (collectively "Toshiba"). The Third Party Website is made available to you as a convenience only and you agree to use the Third Party Website at your own risk. The link of the Third Party Website does not necessarily imply a recommendation or an endorsement by Toshiba of the Third Party Website. Please be aware that Toshiba is not responsible for any transaction done through the Third Party Website, and such transactions shall be subject to terms and conditions which may be provided in the Third Party Website.
A new window will open