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At the Toshiba Innovation Centre we constantly strive to inspire you with our technologies and solutions. Discover how to place us at the heart of your innovations.
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The information presented in this cross reference is based on TOSHIBA's selection criteria and should be treated as a suggestion only. Please carefully review the latest versions of all relevant information on the TOSHIBA products, including without limitation data sheets and validate all operating parameters of the TOSHIBA products to ensure that the suggested TOSHIBA products are truly compatible with your design and application.
Please note that this cross reference is based on TOSHIBA's estimate of compatibility with other manufacturers' products, based on other manufacturers' published data, at the time the data was collected.
TOSHIBA is not responsible for any incorrect or incomplete information. Information is subject to change at any time without notice.
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Package 3D Data (STEP)
3D data (STEP format) of semiconductor package are published.
Download by product
You can download the model file of specific product directly from the parametric search results for each product category, which is useful if you want to download only the models for the products you need.
| By Products | ■MOSFETs |
■Bipolar Transistors/IGBT |
■Diodes |
|---|---|---|---|
■Isolators/Solid State Relays |
■General Purpose Logic ICs |
■Power Management ICs |
|
■Intelligent Power ICs |
■Linear ICs |
You can select and download packages from the parametric search results.
| By Packages |
|---|
You can download the STEP files of all packages at once from the download button below.
| Product Category | Date | File Size | Download |
|---|---|---|---|
| 3D Data (STEP) | October, 2024 | 7.5MB |