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Gehäuse und Verpackungsinformationen
Es wird ein neues Fenster geöffnet
Wir stellen Gehäuseabmessungen und Verpackungsmethoden der Halbleiter von Toshiba vor.
Bei der Entwicklung Ihrer Entwürfe, stellen Sie bitte das Datenblatt sicher.
This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.
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