Package & Packing Information

We introduce package dimensions and packing methods of Toshiba semiconductor.
In developing your designs, please ensure the datasheet.

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

Discrete Device Packages

Parametric Search (CAD data)

  • 3D model(.stp) : 3D model Data in STEP Format
  • Land Pattern(.dxf) : Land pattern Data in DXF Format
  • Land Pattern(.xml) : Land pattern Data in JEITA LPB C-format
  • Land Pattern(.dra) : Land pattern Data for Cadence®OrCAD®
  • Land Pattern(.ftp) : Land pattern Data for Zuken®CR-5000/CR-8000

By products

IC packages by type

Package Mounting Guide

This online document describes design techniques and mounting methods for improving the solder ability and heat dissipation of our products, and aims at producing the printed circuit board assembly (PCBA) with high manufacturability.

名稱

相關信息

Developing Thermal Design Guidelines for Power MOSFETs in a Chassis
Developing Thermal Design Guidelines for Power MOSFETs in a Chassis
Detailed simulations of the thermal behavior of MOSFETs in a closed chassis allow the development of guidelines for improving system design for MOSFET placement in conjunction with the use of fans, grills, and heatsinks.
Thermal Management for Designs Using Discrete Semiconductor Devices
Thermal Management for Designs Using Discrete Semiconductor Devices
There are several effective ways to manage the high temperatures of today’s discrete semiconductors in your design. Simulation techniques are vital for measuring how well each approach is working. This article introduces our thermal simulation results. We hope that this document will help you minimize heat generation problems when designing.
開啟新視窗